1 "www.burshtek.co.kr"
2 Kern W., "The evolution of silicon wafer cleaning technology" 137 : 1887-, 1990
3 S. Wolf, "Silicon processing for the VLSI Era" 1 : 125-, 2000
4 A. A. Busnaina, "Particle adhesion and removal mechanism in Post-CMP cleaning processes" 15 (15): 374-, 2002
5 이우선, "Non-contact post-CMP cleaning에 대한 평가와 기존 scrubbing cleaning과의 비교" 12 (12): 35-, 1999
6 Amick J. A., "Cleanliness and the cleaning of silicon wafers" 19 : 47-, 1976
7 Heroux J. B., "CO2 lazer-assisted removal of submicron particles from solid surfaces" 79 : 2857-, 1996
8 박래학, "CMP post cleaning" 12 (12): 29-, 1999
1 "www.burshtek.co.kr"
2 Kern W., "The evolution of silicon wafer cleaning technology" 137 : 1887-, 1990
3 S. Wolf, "Silicon processing for the VLSI Era" 1 : 125-, 2000
4 A. A. Busnaina, "Particle adhesion and removal mechanism in Post-CMP cleaning processes" 15 (15): 374-, 2002
5 이우선, "Non-contact post-CMP cleaning에 대한 평가와 기존 scrubbing cleaning과의 비교" 12 (12): 35-, 1999
6 Amick J. A., "Cleanliness and the cleaning of silicon wafers" 19 : 47-, 1976
7 Heroux J. B., "CO2 lazer-assisted removal of submicron particles from solid surfaces" 79 : 2857-, 1996
8 박래학, "CMP post cleaning" 12 (12): 29-, 1999