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      전자회로 일체형 돔 형상의 플라스틱 부품 성형에 관한 연구 = A study on the molding of dome shaped plastic parts embedded with electronic circuits

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      https://www.riss.kr/link?id=A106824518

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      다국어 초록 (Multilingual Abstract)

      Smart systems in different application areas such as automotive, medical and consumer electronics require a novel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods including mechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products and complicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate a dome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film was predicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In order to decrease spring-back after thermoforming, the Taguchi method of design of experiment was used. Through ANOVA analysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis, gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on film occurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melt temperature.
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      Smart systems in different application areas such as automotive, medical and consumer electronics require a novel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods including mechanical assembly, bo...

      Smart systems in different application areas such as automotive, medical and consumer electronics require a novel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods including mechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products and complicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate a dome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film was predicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In order to decrease spring-back after thermoforming, the Taguchi method of design of experiment was used. Through ANOVA analysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis, gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on film occurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melt temperature.

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      참고문헌 (Reference)

      1 손진우, "필름 인서트 인몰드 코팅에서의 워시아웃과 휨 변형에 관한 실험적 연구" 대한기계학회 42 (42): 213-219, 2018

      2 이호상, "열진공성형에서 적층필름 두께변화에 대한 수치 및 실험적 해석" 한국소성가공학회 22 (22): 171-177, 2013

      3 성겸손, "열진공성형에서 발생하는 필름의 두께 분포와 패턴 변형에 관한 연구" 한국금형공학회 12 (12): 5-10, 2018

      4 유영길, "열진공성형 공정조건이 적층필름의 두께분포에 미치는 영향" 한국소성가공학회 20 (20): 250-256, 2011

      5 Leong, Y.W, "The effect of molding conditions on mechanical and morphological properties at the interface of film insert injection molded polypropylene-film/polypropylene matrix" 44 (44): 2327-2334, 2004

      6 Islam, A., "Quality investigation of miniaturized moulded interconnect devices(MIDs)for hearing aid application" 64 (64): 539-544, 2015

      7 Phadke, M. S., "Quality Engineering using Robust Design" AT&T Bell Lab., Prentice Hall 1992

      8 Oulu, P. N., "Multilayer structure for accommodating electronics and related method of manufacture"

      9 Dupont, "In-Mold Electronic Technology"

      10 Poller, S., "Film temperatures determine the wall thickness of thermoformed parts" 38 (38): 104-108, 1992

      1 손진우, "필름 인서트 인몰드 코팅에서의 워시아웃과 휨 변형에 관한 실험적 연구" 대한기계학회 42 (42): 213-219, 2018

      2 이호상, "열진공성형에서 적층필름 두께변화에 대한 수치 및 실험적 해석" 한국소성가공학회 22 (22): 171-177, 2013

      3 성겸손, "열진공성형에서 발생하는 필름의 두께 분포와 패턴 변형에 관한 연구" 한국금형공학회 12 (12): 5-10, 2018

      4 유영길, "열진공성형 공정조건이 적층필름의 두께분포에 미치는 영향" 한국소성가공학회 20 (20): 250-256, 2011

      5 Leong, Y.W, "The effect of molding conditions on mechanical and morphological properties at the interface of film insert injection molded polypropylene-film/polypropylene matrix" 44 (44): 2327-2334, 2004

      6 Islam, A., "Quality investigation of miniaturized moulded interconnect devices(MIDs)for hearing aid application" 64 (64): 539-544, 2015

      7 Phadke, M. S., "Quality Engineering using Robust Design" AT&T Bell Lab., Prentice Hall 1992

      8 Oulu, P. N., "Multilayer structure for accommodating electronics and related method of manufacture"

      9 Dupont, "In-Mold Electronic Technology"

      10 Poller, S., "Film temperatures determine the wall thickness of thermoformed parts" 38 (38): 104-108, 1992

      11 Lee, J. K., "Effects of rheological properties and processing parameters on ABS thermoforming" 41 (41): 240-261, 2001

      12 Liu, R. H., "Design of the printing pattern on film for three dimensional molded interconnect devices" 37 (37): 1722-1731, 2018

      13 Acuuform, "Computer Simulations of Transfor -ming and Blowing Molding"

      14 Hwang, H. S., "A study on a wash-out phenomenon in two-component injection molding" 233-237, 2013

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 계속평가 신청대상 (계속평가)
      2022-03-24 학술지명변경 한글명 : 한국금형공학회지 -> Design & Manufacturing
      외국어명 : Journal of the Korea Society of Die & Mould Engineering -> Design & Manufacturing
      KCI등재후보
      2021-01-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
      2020-12-01 평가 등재후보 탈락 (계속평가)
      2018-01-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
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