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IPACK2009-89055 Development of a New Wire Bonding Technology on Integrated Circuit Devices
Jiang, Y.; Sun, R.; Wang, S.; Zhang, C.; Chen, W.; Yu, Y.; Xiao, W. New York; ASME 2010 p.1-8
Huang, Y.H.; Lee, H.-H.; Hwang, S.-J.; Huang, D.-Y. New York; ASME 2010 p.9-14
Jaeger, R.C.; Suhling, J.C.; Hussain, S.; Roberts, J.C.; Motalab, M.A.; Cho, C.-H. New York; ASME 2010 p.15-26
Alzoubi, K.; Lu, S.; Sammakia, B.; Poliks, M. New York; ASME 2010 p.27-32
Watanabe, N.; Kawashita, M.; Yoshimura, Y.; Tanaka, N.; Asano, T. New York; ASME 2010 p.33-38
Dhanasekaran, R.; Jensen, T.; Gadepalli, H.; Briggs, E.; Ramkumar, S.M. New York; ASME 2010 p.39-48
IPACK2009-89336 Flat Tree Networks
Khanduri, P.; Wood, A.; Cohen, D.; Birkeli, I.; Sem-Jacobsen, F. New York; ASME 2010 p.49-56
IPACK2009-89355 Integrating Novel Packaging Technologies for Large Scale Computer Systems
Mitchell, J.; Cunningham, J.; Drost, R.; Krishnamoorthy, A.V.; Ho, R. New York; ASME 2010 p.57-66
Lau, J.H.; Yue, T.G.; Hoe, G.Y.Y.; Wu, Z.X.; Chong, C.T.; Damaruganath, P.; Vaidyanathan, K. New York; ASME 2010 p.67-74
IPACK2009-89414 Investigation of Transfer Mold Process Effects on Semiconductor Package Warpage
Brand, J.M.; Yim, M.J.; Kumar, R. New York; ASME 2010 p.75-82