1 박시환 ; 황연 ; 김대근, "열경화성 소재를 사용한 웨이퍼 레벨 렌즈 성형 중 이형 특성에 관한 연구" 한국산학기술학회 22 (22): 461-467, 2021
2 Dagan, Y., "Wafer-level optics enables low cost camera phones" 7218 : 72180-, 2009
3 Hideaki N, "Thermal Stress Simulation Method in Substrate with Cure Shrinkage Reaction of Thermosetting Resin" 135-138, 2018
4 B. Yates, "The thermal expansion of carbon fibre-reinforced plastics" Springer Science and Business Media LLC 14 (14): 1207-1217, 1979
5 Hong Yu, "Observations of Gelation and Vitrification of a Thermosetting Resin during the Evolution of Polymerization Shrinkage" Wiley 26 (26): 1483-1487, 2005
6 Giles H., "Novel and Low Cost Through Silicon Via Solution for Wafer Scale Packaging of Image Sensors" 179-182, 2008
7 Giles H., "Low Cost Through Silicon Via Solution Compatible with Existing Assembly Infrastructure and Suitable for Single Die and Die Stacked Packages" 61-64, 2008
8 Hongtao Han, "Low Cost Camera Modules Using Integration of Wafer-Scale Optics and Wafer-Level Packaging of Image Sensors" 7631 : 1-7, 2009
9 박시환 ; 문종신, "Lens 성형시 UV경화 반응에 따른 수축 및 변형 대한 해석적 접근" 한국산학기술학회 15 (15): 6464-6471, 2014
10 Chun Li, "In-situ measurement of chemical shrinkage of MY750 epoxy resin by a novel gravimetric method" Elsevier BV 64 (64): 55-64, 2004
1 박시환 ; 황연 ; 김대근, "열경화성 소재를 사용한 웨이퍼 레벨 렌즈 성형 중 이형 특성에 관한 연구" 한국산학기술학회 22 (22): 461-467, 2021
2 Dagan, Y., "Wafer-level optics enables low cost camera phones" 7218 : 72180-, 2009
3 Hideaki N, "Thermal Stress Simulation Method in Substrate with Cure Shrinkage Reaction of Thermosetting Resin" 135-138, 2018
4 B. Yates, "The thermal expansion of carbon fibre-reinforced plastics" Springer Science and Business Media LLC 14 (14): 1207-1217, 1979
5 Hong Yu, "Observations of Gelation and Vitrification of a Thermosetting Resin during the Evolution of Polymerization Shrinkage" Wiley 26 (26): 1483-1487, 2005
6 Giles H., "Novel and Low Cost Through Silicon Via Solution for Wafer Scale Packaging of Image Sensors" 179-182, 2008
7 Giles H., "Low Cost Through Silicon Via Solution Compatible with Existing Assembly Infrastructure and Suitable for Single Die and Die Stacked Packages" 61-64, 2008
8 Hongtao Han, "Low Cost Camera Modules Using Integration of Wafer-Scale Optics and Wafer-Level Packaging of Image Sensors" 7631 : 1-7, 2009
9 박시환 ; 문종신, "Lens 성형시 UV경화 반응에 따른 수축 및 변형 대한 해석적 접근" 한국산학기술학회 15 (15): 6464-6471, 2014
10 Chun Li, "In-situ measurement of chemical shrinkage of MY750 epoxy resin by a novel gravimetric method" Elsevier BV 64 (64): 55-64, 2004
11 J. Zhang, "Effect of cure cycle on curing process and hardness for epoxy resin" Department of Polymer Engineering, Scientific Society of Mechanical Engineering 3 (3): 534-541, 2009
12 Snow, A.W., "Dilatometry on Thermoset Resins" NRL Maeminmdu 1991
13 Mohsan Haider, "Cure shrinkage characterization and modeling of a polyester resin containing low profile additives" Elsevier BV 38 (38): 994-1009, 2007
14 B. Patham, "COMSOLÆ Implementation of a viscoelastic model with cure-temperature-time superposition for predicting cure stresses and springback in a thermoset resin"
15 He Pingsheng, "An epoxy resin copolymer with zero shrinkage" Springer Science and Business Media LLC 24 (24): 1528-1532, 1989
16 "ASTM D2566, Standard test method for linear shrinkage of cured thermosettings casting resins during cure"