수직형 식각 장비의 노즐 분사 시스템에 대한 연구 = A Research of Nozzle Spray System of Vertical Type Etcher

다국어 초록 (Multilingual Abstract)

The recent PCB (Printed Circuit Board) wet etcher has been needed to process pattern within 20μm width on a 40μm-thick board. A previous PCB etcher can be used with multiple points of roller rolls or slips off a board. Also, the damage of the board by contacting the roller increases the friction defects. A vertical type boards transporting process is developed to solve the problems of boards friction and sagging in a horizontal etcher. In this research, CFD (Computational Fluid Dynamics) method is used to design an improved spray nozzle including the critical part of etcher, and establish the design method. Meanwhile, major spray characteristics are expected in diverse nozzle types and variables. Lastly, diverse simulation results are adapted to design an improved nozzle and spray system.

참고문헌 (Reference)

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