Microstructure Evolution Mechanism and Corrosion Behavior of Transient Liquid Phase Bonded 304L Stainless Steel

다국어 초록 (Multilingual Abstract)

Transient liquid phase (TLP) bonding of 304L austenitic stainless steel was carried out using MBF-20 interlayer at 1070 °Cwith different holding times. The effect of bonding time on the microstructure and corrosion resistance of the TLP bondedsamples was investigated aiming to obtain the optimal bonding time. The results showed that isothermal solidification wascompleted within 45 min at 1070 °C and shorter holding times gave rise to the formation of intermetallic compounds at thejoint centerline. It was found that the solidification sequence in the joint region is as follows: (1) isothermal solidification ofγ solid solution, (2) formation of ternary eutectic of γ + Ni boride + Cr boride, and (3) formation of ternary eutectic of γ + Niboride + Ni–Si–B compound in the athermally solidified zone. Final stage of the phase formation at the joint centerline wasthe precipitation of Ni3Siparticles in the vicinity of eutectic microconstituents via a solid state transformation. ExtensiveCr-rich borides were formed in the diffusion affected zone as a result of B diffusion into the base metal during bondingprocess. Corrosion behavior of the TLP bonded samples was studied in 3.5% NaCl solution. The joint corrosion resistancewas improved with the increase of the bonding time to 30 min and then decreased when the holding time was prolonged.

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