- CONTENTS
- 1 Introduction to 3D Microelectronic Packaging / Yan Li ; Deepak Goyal = 1
- 2 3D Packaging Architectures and Assembly Process Design / Ravi Mahajan ; Bob Sankman = 17
- 3 Materials and Processing of TSV / Praveen Kumar ; Indranath Dutta ; Zhiheng Huang ; Paul Conway = 47
- 4 Microstructural and Reliability Issues of TSV / Praveen Kumar ; Indranath Dutta ; Zhiheng Huang ; Paul Conway = 71
다국어 입력
あ
ぁ
か
が
さ
ざ
た
だ
な
は
ば
ぱ
ま
や
ゃ
ら
わ
ゎ
ん
い
ぃ
き
ぎ
し
じ
ち
ぢ
に
ひ
び
ぴ
み
り
う
ぅ
く
ぐ
す
ず
つ
づ
っ
ぬ
ふ
ぶ
ぷ
む
ゆ
ゅ
る
え
ぇ
け
げ
せ
ぜ
て
で
ね
へ
べ
ぺ
め
れ
お
ぉ
こ
ご
そ
ぞ
と
ど
の
ほ
ぼ
ぽ
も
よ
ょ
ろ
を
ア
ァ
カ
サ
ザ
タ
ダ
ナ
ハ
バ
パ
マ
ヤ
ャ
ラ
ワ
ヮ
ン
イ
ィ
キ
ギ
シ
ジ
チ
ヂ
ニ
ヒ
ビ
ピ
ミ
リ
ウ
ゥ
ク
グ
ス
ズ
ツ
ヅ
ッ
ヌ
フ
ブ
プ
ム
ユ
ュ
ル
エ
ェ
ケ
ゲ
セ
ゼ
テ
デ
ヘ
ベ
ペ
メ
レ
オ
ォ
コ
ゴ
ソ
ゾ
ト
ド
ノ
ホ
ボ
ポ
モ
ヨ
ョ
ロ
ヲ
―
http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
예시)
- 中文 을 입력하시려면 zhongwen을 입력하시고 space를누르시면됩니다.
- 北京 을 입력하시려면 beijing을 입력하시고 space를 누르시면 됩니다.
А
Б
В
Г
Д
Е
Ё
Ж
З
И
Й
К
Л
М
Н
О
П
Р
С
Т
У
Ф
Х
Ц
Ч
Ш
Щ
Ъ
Ы
Ь
Э
Ю
Я
а
б
в
г
д
е
ё
ж
з
и
й
к
л
м
н
о
п
р
с
т
у
ф
х
ц
ч
ш
щ
ъ
ы
ь
э
ю
я
′
″
℃
Å
￠
￡
￥
¤
℉
‰
＄
％
Ｆ
￦
㎕
㎖
㎗
ℓ
㎘
㏄
㎣
㎤
㎥
㎦
㎙
㎚
㎛
㎜
㎝
㎞
㎟
㎠
㎡
㎢
㏊
㎍
㎎
㎏
㏏
㎈
㎉
㏈
㎧
㎨
㎰
㎱
㎲
㎳
㎴
㎵
㎶
㎷
㎸
㎹
㎀
㎁
㎂
㎃
㎄
㎺
㎻
㎽
㎾
㎿
㎐
㎑
㎒
㎓
㎔
Ω
㏀
㏁
㎊
㎋
㎌
㏖
㏅
㎭
㎮
㎯
㏛
㎩
㎪
㎫
㎬
㏝
㏐
㏓
㏃
㏉
㏜
㏆
https://www.riss.kr/link?id=M15012192
- 저자
-
발행사항
Cham, Switzerland : Springer, [2017] ⓒ2017
-
발행연도
2017
-
작성언어
영어
- 주제어
-
DDC
621.381 판사항(23)
-
ISSN
2197-6643 (electronic)
-
ISBN
9783319445847
3319445847
9783319445861 (eBook)
3319445863 (eBook) -
자료형태
단행본(다권본)
-
발행국(도시)
스위스
-
서명/저자사항
3D microelectronic packaging : from fundamentals to applications / Yan Li, Deepak Goyal, editors
-
형태사항
ix, 463 pages : illustrations (some color) ; 24 cm
-
총서사항
Springer series in advanced microelectronics, 1437-0387 ; volume 57 Springer series in advanced microelectronics ; volume 57
-
일반주기명
Includes bibliographical references and index
-
소장기관
- 국립금오공과대학교 도서관
- 국립중앙도서관
- 서울과학기술대학교 도서관
- 국립금오공과대학교 도서관
-
0
상세조회 -
0
다운로드
인용문이 복사되었습니다.
부가정보
목차 (Table of Contents)
- CONTENTS
- 1 Introduction to 3D Microelectronic Packaging / Yan Li ; Deepak Goyal = 1
- 2 3D Packaging Architectures and Assembly Process Design / Ravi Mahajan ; Bob Sankman = 17
- 3 Materials and Processing of TSV / Praveen Kumar ; Indranath Dutta ; Zhiheng Huang ; Paul Conway = 47
- 4 Microstructural and Reliability Issues of TSV / Praveen Kumar ; Indranath Dutta ; Zhiheng Huang ; Paul Conway = 71
- 5 Fundamentals and Failures in Die Preparation for 3D Packaging / Hualiang Shi ; Erasenthiran Poonjolai = 101
- 6 Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging / Tadatomo Suga ; Ran He ; George Vakanas ; Antonio La Manna = 129
- 7 Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5／3D Packages / Sangil Lee = 157
- 8 Fundamentals of Solder Alloys in 3D Packaging / Kwang-Lung Lin = 205
- 9 Fundamentals of Electromigration in Interconnects of 3D Packaging / Pilin Liu = 223
- 10 Fundamentals of Heat Dissipation in 3D IC Packaging / Satish G. Kandlikar ; Amlan Ganguly = 245
- 11 Fundamentals of Advanced Materials and Processes in Organic Substrate Technology / Songhua Shi ; Peter Tortorici = 261
- 12 Die and Package Level Thermal and Thermal／Moisture Stresses in 3D Packaging : Modeling and Characterization / Liangbiao Chen ; Tengfei Jiang ; Xuejun Fan = 293
- 13 Processing and Reliability of Solder Interconnections in Stacked Packaging / Paul Vianco = 333
- 14 Interconnect Quality and Reliability of 3D Packaging / Yaodong Wang ; Yingxia Liu ; Menglu Li ; K.N. Tu ; Luhua Xu = 375
- 15 Fault Isolation and Failure Analysis of 3D Packaging / Yan Li ; Deepak Goyal = 421
- Index = 461
분석정보
연관 공개강의(KOCW)
이 자료와 함께 이용한 RISS 자료
나만을 위한 추천자료
