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2 서동환 ; 강태엽 ; 유진호 ; 민준기 ; 박창근, "The defect detection circuit of an electronic circuit through impedance change detection that induces a change in S-parameter" 25 (25): 689-696, 2021
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4 B. Li, "Reliability challenges for copper interconnects" 44 (44): 365-380, 2004
5 T. Y. Kang, "Reliability Assessment on Electrical Interconnects by Machine Learning With Magnitude and Phase Data of RF signals" 167-, 2023
6 B. Choe, "Reliability Assessment of Solder Joints Using Electrical Model on Cracking and S-Parameter Pattern Analysis(in Kor.)" 11 (11): 990-998, 2021
7 F. Caspers, "RF engineering basic concepts : the Smith chart"
8 T. Y. Kang, "Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by SParameter Analysis" 11 (11): 990-998, 2021
9 C. Kosemen, "Multi-label classification of line chart images using convolutional neural networks" 2 (2): 2020
10 "MIL-STD-810G: Environmental Engineering Considerations and Laboratory Tests"
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