In this study, we have investigated the influence of sputtering conditions(Ar pressure, Input power) on deposition rate of Ni81Fe19, Fe, Co, Cu, Cr86A114, Cr93Ga7 thin films produced by the method of DC magnetron sputtering. In all films, we have obse...
In this study, we have investigated the influence of sputtering conditions(Ar pressure, Input power) on deposition rate of Ni81Fe19, Fe, Co, Cu, Cr86A114, Cr93Ga7 thin films produced by the method of DC magnetron sputtering. In all films, we have observed that the deposition rate increased with input power because of increasing sputter yield, and ion current density. we have found that the deposition rate was decreased with the pressure of Ar gas.