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      KCI등재 SCOPUS SCIE

      Thermal Properties and Water Sorption Behaviors of Epoxy and Bismaleimide Composites

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      https://www.riss.kr/link?id=A104693220

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      다국어 초록 (Multilingual Abstract)

      In this work, we prepared epoxy/BMI composites by using N,N'-bismaleimide-4,4'-diphenylmethane (BMI), epoxy resin (diglycidyl ether of bisphenol-A (DGEBA)), and 4,4'-diamino diphenyl methane (DDM). The thermal properties and water sorption behaviors of the epoxy and BMI composites were investigated. For the epoxy/ BMI composites, the glass transition and decomposition temperatures both increased with increasing BMI addition, which indicates the effect of BMI addition on improved thermal stability. The water sorption behaviors were gravi metrically measured as a function of humidity, temperature, and composition. The diffusion coefficient and water uptake decreased and the activation energy for water diffusion increased with increasing BMI content, indicating that the water sorption in epoxy resin, which causes reliability problems in electronic devices, can be diminished by BMI addition. The water sorption behaviors in the epoxy/BMI composites were interpreted in terms of their chemical and morphological structures.
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      In this work, we prepared epoxy/BMI composites by using N,N'-bismaleimide-4,4'-diphenylmethane (BMI), epoxy resin (diglycidyl ether of bisphenol-A (DGEBA)), and 4,4'-diamino diphenyl methane (DDM). The thermal properties and water sorption behaviors o...

      In this work, we prepared epoxy/BMI composites by using N,N'-bismaleimide-4,4'-diphenylmethane (BMI), epoxy resin (diglycidyl ether of bisphenol-A (DGEBA)), and 4,4'-diamino diphenyl methane (DDM). The thermal properties and water sorption behaviors of the epoxy and BMI composites were investigated. For the epoxy/ BMI composites, the glass transition and decomposition temperatures both increased with increasing BMI addition, which indicates the effect of BMI addition on improved thermal stability. The water sorption behaviors were gravi metrically measured as a function of humidity, temperature, and composition. The diffusion coefficient and water uptake decreased and the activation energy for water diffusion increased with increasing BMI content, indicating that the water sorption in epoxy resin, which causes reliability problems in electronic devices, can be diminished by BMI addition. The water sorption behaviors in the epoxy/BMI composites were interpreted in terms of their chemical and morphological structures.

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      참고문헌 (Reference)

      1 "in Polymers for Microelectronics" 1994

      2 "in Polymer Materials for Electronic Applications" 1982

      3 "in Plastic Packaging of Microelectronic Devices" 1990.

      4 "in Handbook of Polymer Coat ings for Electronics" 1990.

      5 "in Diffusion in Polymers" Academic Press 1968.

      6 "Advances in Chemistry" 1991

      1 "in Polymers for Microelectronics" 1994

      2 "in Polymer Materials for Electronic Applications" 1982

      3 "in Plastic Packaging of Microelectronic Devices" 1990.

      4 "in Handbook of Polymer Coat ings for Electronics" 1990.

      5 "in Diffusion in Polymers" Academic Press 1968.

      6 "Advances in Chemistry" 1991

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      유사연구자 (20) 활용도상위20명

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
      2020-01-01 평가 등재학술지 유지 (해외등재 학술지 평가) KCI등재
      2012-06-04 학술지명변경 외국어명 : 미등록 -> Macromolecular Research KCI등재
      2008-01-01 평가 SCI 등재 (등재유지) KCI등재
      2006-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2004-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2001-07-01 평가 등재학술지 선정 (등재후보2차) KCI등재
      1999-01-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
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      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 1.4 0.33 0.97
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.75 0.62 0.296 0.21
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