UV 레이저를 이용한 마이크로 히터 트리밍 = Micro Heater Trimming using UV Laser

다국어 초록 (Multilingual Abstract)

In this paper, a new method of laser trimming of thick film heater is studied. Various laser waves (IR, Green, UV) are used to ablation the heater and the process parameters are also presented. For given initial printed resisters, the cutting length should be prepared to obtain the target resister value in advance. Therefore, the cutting model is very important. The well-known model was tested and proven that it is valid only within a certain range of cutting length. A new model is proposed for a wide range of resister laser trimming. The cutting lengths and resister variation was obtained and formulated. To verify the presented method, the cutting lengths of each resister are calculated for various target resister value and laser trimming using UV is conducted.

참고문헌 (Reference)

1 노상수, "자외선 레이져를 이용한 고정밀 저항체 가공기술 개발" 한국센서학회 11 (11): 6-, 2002

2 류광현, "나노초 펄스폭을 갖는 자외선 레이저를 이용한 전자회로기판의 저항체 트리밍과 절단공정 특성에 관한 연구" 한국정밀공학회 27 (27): 23-28, 2010

3 Marek Wronski, "New trim configuration for laser trimmed thick resistors" 45 : 1941-1948, 2005

4 A. F. Dyson, "Laser Trimming of Thick Film Resistors" 1 : 51-57, 1974

5 Michael J.Mueller, "Functional laser trimming of thin film resistors on silicon ICs" 611 : 70-84, 1986