1 "in Proceedings of the 3rd International Symposium on Electronic Materials and Packagings 2001" 376-381,
2 "Walker, and P. Elsner" 74-75 : 682-, 1995
3 "T. -M. Ko, and H. Hiraoka," 24 : 1-, 1996
4 "Martinu, and F. Poncin-Epaillard," 290-291 : 68-, 1996
5 "G. Leps, and J. Meinhardt," 116-119 : 986-, 1999
6 ". Poncin-Epaillard" 107 : 199-, 2001
1 "in Proceedings of the 3rd International Symposium on Electronic Materials and Packagings 2001" 376-381,
2 "Walker, and P. Elsner" 74-75 : 682-, 1995
3 "T. -M. Ko, and H. Hiraoka," 24 : 1-, 1996
4 "Martinu, and F. Poncin-Epaillard," 290-291 : 68-, 1996
5 "G. Leps, and J. Meinhardt," 116-119 : 986-, 1999
6 ". Poncin-Epaillard" 107 : 199-, 2001