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      KCI등재

      정전척 표면의 세라믹물질 적층 순서에 따른 온도 특성에 관한 연구 = A Study on Temperature Characteristics according to Ceramic Material Stacking Sequence of Electrostatic Chuck Surface

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      https://www.riss.kr/link?id=A105103510

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      다국어 초록 (Multilingual Abstract)

      Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.
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      Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. Th...

      Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.

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      다국어 초록 (Multilingual Abstract)

      Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.
      번역하기

      Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. Th...

      Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.

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      참고문헌 (Reference)

      1 Suhas V. Patankar, "Numerical Heat Transfer and Fluid Flow" McGrow-Hill Book Company 1980

      2 Tretheway, D., "Modeling of Heat Transport and Wafer Healing Effects during Plasma Etching" 143 : 3674-3680, 1996

      3 K. Asano, "Fundamental Study of an electrostatic chuck for silicon wafer handling" 38 (38): 2002

      4 L.D. Hartsough, "Electrostatic Wafer Holding" 35 (35): 87-90, 1993

      5 S. A. Khomyakov, "Attraction and Accuracy Characteristic of Electrostatic Chucks" 50 (50): 24-, 1979

      1 Suhas V. Patankar, "Numerical Heat Transfer and Fluid Flow" McGrow-Hill Book Company 1980

      2 Tretheway, D., "Modeling of Heat Transport and Wafer Healing Effects during Plasma Etching" 143 : 3674-3680, 1996

      3 K. Asano, "Fundamental Study of an electrostatic chuck for silicon wafer handling" 38 (38): 2002

      4 L.D. Hartsough, "Electrostatic Wafer Holding" 35 (35): 87-90, 1993

      5 S. A. Khomyakov, "Attraction and Accuracy Characteristic of Electrostatic Chucks" 50 (50): 24-, 1979

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      공동연구자 (7)

      유사연구자 (20) 활용도상위20명

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2027 평가예정 재인증평가 신청대상 (재인증)
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      2019-01-01 평가 등재학술지 유지 (계속평가) KCI등재
      2016-01-01 평가 등재학술지 유지 (계속평가) KCI등재
      2012-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2010-03-25 학회명변경 한글명 : 한국반도체및디스플레이장비학회 -> 한국반도체디스플레이기술학회
      영문명 : The Korean Society of Semiconductor & Display Equipment Technology -> The Korean Society of Semiconductor & Display Technology
      KCI등재
      2010-03-25 학술지명변경 한글명 : 반도체및디스플레이장비학회지 -> 반도체디스플레이기술학회지
      외국어명 : Journal of the Semiconductor and Display Equipment Technology -> Journal of the Semiconductor & Display Technology
      KCI등재
      2009-01-01 평가 등재학술지 선정 (등재후보2차) KCI등재
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      2006-01-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
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      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 0.29 0.29 0.26
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.21 0.18 0.217 0.02
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