In this study, for the purpose of reducing the working hours of polishing process and preventing the mix of pollutants for optical splitter FAB(Fiber Array Block), which arrays and connects optical fiber to Planar Waveguide Devices (Chip), which is av...
In this study, for the purpose of reducing the working hours of polishing process and preventing the mix of pollutants for optical splitter FAB(Fiber Array Block), which arrays and connects optical fiber to Planar Waveguide Devices (Chip), which is available to separate optical signal, the backside grinding method of grinding wheel and the automatic polishing machine into which FAB falls had been developed and applied to facilitate chip evacuation, unlike the upper surface grinding method of the conventional polishing pad.
As a result, in case of multi bar chip(1ch×10×8ea), the 1st rough grinding at 350㎛ consumed four hours or more before but, now becomes to take less than three minutes to complete, and also prevent mixing of pollutants.