Assessment of residual stress is an important point to prevent the failures of thin film devices. Nanoindentation technique was proposed as a stress-measuring method of thin film in a previous research. However, the stress-analyzing model used at the ...
Assessment of residual stress is an important point to prevent the failures of thin film devices. Nanoindentation technique was proposed as a stress-measuring method of thin film in a previous research. However, the stress-analyzing model used at the previous research had the problems of a partial deformation-irrelative stress interaction concept and no consideration of the change in the contact area during continuous stress relaxation. Therefore, we modified the model by analyzing a new residual stress-induced normal load based on deformation-dependent shear stress component and by calculating the continuous relaxation procedure as an integration method. The modified model was applied to evaluate the residual stresses in two diamond-like carbon films. The evaluated residual stresses from the newly modified model were more consistent with the results from the conventional curvature method than those from the earlier model.