NCA 물성에 따른 극미세 피치 COG (Chip on Glass) In, Sn 접합부의 신뢰성 특성평가 = Improvement of Reliability of COG Bonding Using In, Sn Bumps and NCA

다국어 초록 (Multilingual Abstract)

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

참고문헌 (Reference)

1 "Trend of Solder-less Joint in Flip Chip Bonding" 168-172, 2001

2 "Overview of Conductive Adhesive Interconnection Technologies for LCDs" 21 (21): 208-214, 1998

3 "Overview of Conductive Adhesive Interconnection Technologies for LCD's" 21 (21): 208-21, 1998

4 "Novel application of diffusion soldering" 8 (8): 12-, 1996

5 "Low Cost Flip Chip Technologies for DCA,WLCSP and PBGA Assemblies" 1990

6 "Experimental and Theoretical Characterization of Electrical Contact in Anisotropically Conductive Adhesive" 15-21, 2000

7 "Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization" 390 : 67-73, 2005

8 "Development and reliability of non-conductive adhesive flip-chip packaging" 1-8, 2004

9 "Contact resistance of the Chip-on-Glass bonded 48Sn-52In solder joint" 46 (46): 1042-1046, 2005

10 "Binary alloy phase diagrams" ASM International 2295-2296, 1999

11 "A new low temperature bonding technique using In and Sn solder bumps" 93 : 2003