1 최재영, "공정 조성의 SnPb 솔더에서의 Electromigration 거동" 한국전기전자재료학회 16 (16): 2003
2 H. Gan, "Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples" 97 : 063514-, 2005
3 J. M. Koo, "Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows" 37 : 118 -, 2008
4 K. Zeng, "Kirkendall void formation in eutectic Sn-Pb solder joint on bare Cu and its effect on joint reliability" 97 : 024508-, 2005
5 Z. Huang, "Initiation and arrest of an interfacial crack in a four-point bend test" 72 : 2584 -, 2005
6 T. Y. Lee, "Electromigration of eutectic SnPb and SnAgCu flip chip solder bumps and under-bump metallization" 90 : 4502 -, 2001
7 J. R. Lloyd, "Electromigration in integrated circuit conductors" 32 : 109-, 1999
8 K. Yamanaka, "Electromigration effect on solder bump in Cu/Sn–3Ag– 0.5Cu/Cu system" 55 : 867 -, 2006
9 M. Ding, "Effect of contact metallization on electromigration reliability of Pb-free solder joints" 99 : 094906-, 2006
10 K. N. Chiang, "Current crowding-induced electromigration in SnAgCu microbumps" 88 : 072102-, 2006
1 최재영, "공정 조성의 SnPb 솔더에서의 Electromigration 거동" 한국전기전자재료학회 16 (16): 2003
2 H. Gan, "Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples" 97 : 063514-, 2005
3 J. M. Koo, "Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows" 37 : 118 -, 2008
4 K. Zeng, "Kirkendall void formation in eutectic Sn-Pb solder joint on bare Cu and its effect on joint reliability" 97 : 024508-, 2005
5 Z. Huang, "Initiation and arrest of an interfacial crack in a four-point bend test" 72 : 2584 -, 2005
6 T. Y. Lee, "Electromigration of eutectic SnPb and SnAgCu flip chip solder bumps and under-bump metallization" 90 : 4502 -, 2001
7 J. R. Lloyd, "Electromigration in integrated circuit conductors" 32 : 109-, 1999
8 K. Yamanaka, "Electromigration effect on solder bump in Cu/Sn–3Ag– 0.5Cu/Cu system" 55 : 867 -, 2006
9 M. Ding, "Effect of contact metallization on electromigration reliability of Pb-free solder joints" 99 : 094906-, 2006
10 K. N. Chiang, "Current crowding-induced electromigration in SnAgCu microbumps" 88 : 072102-, 2006
11 H. Y. Son, "Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications" 864-, 2007
12 V. S. Rao, "Bed of Nails-100 microns pitch wafer level interconnection process" 449 -, 2004
13 P. G. Charalambides, "A test specimen for determining the fracture resistance of bimaterial interfaces" 111 : 77 -, 1989