The mechanical behavior of small-sized materials has been investigated for many industrial applications, including MEMS and semiconductors. It is challenging to obtain accurate mechanical properties measurements for thin films due to several technical...
The mechanical behavior of small-sized materials has been investigated for many industrial applications, including MEMS and semiconductors. It is challenging to obtain accurate mechanical properties measurements for thin films due to several technical difficulties, including measurement of strain, specimen alig㎚ent, and fabrication. In this work, we used the micro-tensile testing unit with the real-time DIC (Digital Image Correlation) strain measurement system. This system has advantages of real time strain monitoring up to 50 ㎚ resolution during the micro-tensile test, and ability to measure the young’s modulus and Poisson’s ratio at the same time. The mechanical properties of SCS (Single Crystal Silicon) are measured by uniaxial tension test from freestanding SCS which are 2.5 ㎛ thick, 200-500 ㎛ wide specimens on the (100) plane. Young’s modulus, Poisson’s ratio and tensile strength in the 〈110〉 direction are measured by micro-tensile testing system.