In this thesis, the bendable thin film transistors (TFTs) with hydrogenated amorphous silicon (a-Si:H) and amorphous indium gallium zinc oxide (a-IGZO) channels were fabricated on the plastic substrate and their mechanical and electrical characteristi...
In this thesis, the bendable thin film transistors (TFTs) with hydrogenated amorphous silicon (a-Si:H) and amorphous indium gallium zinc oxide (a-IGZO) channels were fabricated on the plastic substrate and their mechanical and electrical characteristics under bending strain were investigated through experiment and simulation. In chapter 1, fundamental theories of bendable TFTs with a-Si:H and a-IGZO channels and the failure mechanism to mechanical strain were introduced. In chapter 2, experimental procedures for the fabrication of the bendable TFTs with a-Si:H and a-IGZO channels were described in detail. In chapter 3, the influence of overlapped gate region and various channel widths on the electrical characteristics of the bendable a-Si:H TFTs under bending stress are investigated by the mechanical simulation. In addition, effect of physical densification on sub-gap density of states distribution in a-IGZO film and the electrical characteristics of bendable a-IGZO TFTs as function of bending radius are discussed. In conclusion, the electrical characteristics of bendable TFTs with a-Si:H and a-IGZO channels and the mechanical analysis of bending stress exhibited possibilities for application in the bendable electronics including displays.