Biaxial fracture strength of the commercial 200mm Czochralski single crystal silicon wafer was measured by the ring-on-ring technique and was compared with theoretical strength of Si single crystal. The ring-on-ring apparatus was newly designed and ma...
Biaxial fracture strength of the commercial 200mm Czochralski single crystal silicon wafer was measured by the ring-on-ring technique and was compared with theoretical strength of Si single crystal. The ring-on-ring apparatus was newly designed and manufactured after analyzing stress distribution in ring-on-ring test with FEM(Finite Element Method) computerized simulation. Weibull modulus of the silicon wafer was also calculated from the measured fracture strength.