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      코팅 물질에 따른 알루미늄의 접촉저항 변화 = Effect of Coating Materials on the Contact Resistance of Aluminium

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      https://www.riss.kr/link?id=A75669974

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      다국어 초록 (Multilingual Abstract)

      Heat transfer process is important for many applicable fields such as heat exchanger, construction material, and aircraft body. Heat conduction is much affected by contact resistance between two different material interfaces. In this study, various experimental conditions were tested to decrease contact resistance and to increase thermal conductivity with several coating materials. Aluminium pieces of 2 mm, 4 mm were used as test samples. Copper powder (a few micrometer diameter), copper powder/silicon oil (80/20 weight ratio), and conductive paste were used as coating materials. When the conductive paste and (copper powder+silicon oil) blend were used, thermal conductivity was higher than when no coating materials were used. However, when only the copper powder was used, thermal conductivity value was not stable enough.
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      Heat transfer process is important for many applicable fields such as heat exchanger, construction material, and aircraft body. Heat conduction is much affected by contact resistance between two different material interfaces. In this study, various ex...

      Heat transfer process is important for many applicable fields such as heat exchanger, construction material, and aircraft body. Heat conduction is much affected by contact resistance between two different material interfaces. In this study, various experimental conditions were tested to decrease contact resistance and to increase thermal conductivity with several coating materials. Aluminium pieces of 2 mm, 4 mm were used as test samples. Copper powder (a few micrometer diameter), copper powder/silicon oil (80/20 weight ratio), and conductive paste were used as coating materials. When the conductive paste and (copper powder+silicon oil) blend were used, thermal conductivity was higher than when no coating materials were used. However, when only the copper powder was used, thermal conductivity value was not stable enough.

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