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ELECTROPLATING: Sub-100nm interconnects using multistep plating
Yang, M. X.; Mao, D.; Yu, C.; Dukovic, J.; Xi, M. SOLID STATE TECHNOLOGY 2003 p.37-42
Challenges in gate stack engineering
Murto, R. W.; Gardner, M. I.; Brown, G. A.; Zeitzoff, P. M.; Huff, H. R. SOLID STATE TECHNOLOGY 2003 p.43-52
Planarizing difficult topographies using contact planarization
Lamb, J. E.; Daffron, M.; Hopper, R.; Whittaker, M.; Scott, S. SOLID STATE TECHNOLOGY 2003 p.53-58
Phase shifting methods at 65nm: A comparison of AAPSM and CLM
Kroyan, A.; Liu, H.-Y. SOLID STATE TECHNOLOGY 2003 p.59-63
Novel technology for handling very thin wafers
Binder, A.; Kroupa, G. SOLID STATE TECHNOLOGY 2003 p.64-70
Using numerical simulation to optimize 300mm FOUP purging
Bernard, R.; Kambara, H.; Favre, A.; Descamp, P.; Roche, A. SOLID STATE TECHNOLOGY 2003 p.71-76
Metal deposition in power semiconductors
Butler, D.; Lacey, D.; Jakkaraju, R. SOLID STATE TECHNOLOGY 2003 p.77-82
Meeting industry needs with laser micromachining
Held, A.; Li, M. SOLID STATE TECHNOLOGY 2003 p.83-90