전자패키징용 금속복합재료의 제조공정 해석 및 충격특성평가 = Fabrication Process and Impact Characteristic Analysis of Metal Matrix Composite for Electronic Packaging Application

다국어 초록 (Multilingual Abstract)

This study developed fabrication process of SiC_p/Al metal matrix composites as electronic packaging materials by squeeze casting method. The SiC_p preform were fabricated in newly designed preform mold using about 0.8% of inorganic binder(SiO_2) and 5 vol.% of Al_2O_3 fiber. To infiltrate the molten metal into the preform, fabrication condition such as the temperature and the pressure were selected. Applying the fabrication conditions, heat transfer analysis were preformed using finite element method and thus analyzed the temperature distribution and cooling characteristic during the squeeze casting. For the fabricated composites, impact toughness and thermal expansion coefficient were measured. The metal matrix composites developed in this study have 0.2∼0.3 J impact toughness, 8∼10 ppm/℃ thermal expansion coefficient and 2.9∼3.0g/㎤ density which is appropriate properties for electronic packaging application.