Plasma-enhanced chemical vapor deposition is a complex multi-physics process that integrates fluid dynamics, chemical reactions, plasma dynamics, and heat and mass transfer. The design of the reactor, particularly the showerhead configuration, plays a...
Plasma-enhanced chemical vapor deposition is a complex multi-physics process that integrates fluid dynamics, chemical reactions, plasma dynamics, and heat and mass transfer. The design of the reactor, particularly the showerhead configuration, plays a crucial role in influencing the performance of the deposition process, however, analysis of design parameters is often limited due to the complexity of geometries and reactions. This study presents a numerical approach to investigate the flow characteristics and thin film deposition rates for various showerhead designs. A comprehensive two-dimensional axisymmetric model was developed to capture the multi-physics phenomena within the reactor, and the effects of key geometric configurations such as nozzle spacing, size, outlet ports, and chamber height were systematically analyzed. Through a comparative evaluation of flow and deposition characteristics, we assessed the impact of these geometric parameters and provided insights into the design of more efficient reactors, which could potentially allow the design modification or optimization for enhanced performance of the system in a wide range of industrial applications.