Effect of Wire-Drawing Process Conditions on Secondary Recrystallization Behavior During Annealing in High-Purity Copper Wires

다국어 초록 (Multilingual Abstract)

The relationship between the process condition of wire-drawing and the microstructural evolution during the subsequentannealing was investigated for the production of high-purity copper wires. Three wire-drawing process conditions wereconsidered according to the reduction in the area per pass and the die angle, and their effects on the evolution of the grainstructure and texture during annealing were investigated. Strain distributions, calculated using the finite element method,showed that the shear strain near the wire surface varies according to the process condition. The electron backscatter diffractionresults indicate that the location on the cross-section of the wire, where secondary recrystallization initiates duringannealing, is closely related to the shear strain during wire-drawing. Meanwhile, the effect of shear deformation on the grainstructure and texture after primary recrystallization is insignificant. Drawing process conditions with a small reduction in thearea per pass and die angle resulted in a relatively small shear strain and gave rise to the onset of secondary recrystallizationat the central region of the wires. In contrast, the condition with a large reduction in the area per pass and die angle led to ahigh shear strain and the onset of secondary recrystallization at the peripheral region of the wire. The observed primary andsecondary recrystallization behavior during annealing was explained from the viewpoint of dynamic material phenomenaand inhomogeneity in the local recrystallization texture, regulated by the extent of shear deformation during wire-drawing.

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