전자부품 리드프레임용 Cu-Sn-P 합금의 미세구조에 미치는 합금조성 및 열가공 변형 영향연구 = Effect of Alloy Composition and Thermomechanical Process on the Microtructure of Cu-Sn-P Alloys

다국어 초록 (Multilingual Abstract)

Miicrostructure and mechanical properties of Cu-Sn and Cu-Sn-P (phosphor alloys) alloys were studied for the leadframe application of electronics packaging. The as-cast alloys were thermomechanically processed(TMP) by swaging to increase the alloy strength and grain refinement. Microstructure of the alloys were studied by Transmission Electron Microscopy. Brittle Cu₃Sn compounds were formed in the as-cast condition, however, the compound were dissolved during the subsequent TMP. Tensile strength increases as the addition of Sn and P increase. Electrical resistivity and workability of Cu-Sn alloys are further discussed as a function of alloy composition and deformation.