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      다국어 초록 (Multilingual Abstract) kakao i 다국어 번역

      The dependency of the electrical characteristics of silicon solar-cells on the depth of damaged layer induced by wire-sawing process was investigated. To compare cell efficiency with residual sawing damage, silicon solar-cells were fabricated by using as-sawn wafers having different depth of saw damage without any damaged etching process. The damaged layer induced by wire-sawing process in silicon bulk intensely influenced the value of fill factor on solar cells, degrading fill factor to 57.20%. In addition, the photovoltaic characteristics of solar cells applying texturing process shows that although the initial depth of saw-damage induced by wire-sawing process was different, the value of short-circuit current, fill-factor, and power-conversion-efficiency have an almost same, showing ~17.4% of cell efficiency. It indicated that the degradation of solar-cell efficiency induced by wire-sawing process could be prevented by eliminating all damaged layer through sufficient pyramid-surface texturing process.
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      The dependency of the electrical characteristics of silicon solar-cells on the depth of damaged layer induced by wire-sawing process was investigated. To compare cell efficiency with residual sawing damage, silicon solar-cells were fabricated by using...

      The dependency of the electrical characteristics of silicon solar-cells on the depth of damaged layer induced by wire-sawing process was investigated. To compare cell efficiency with residual sawing damage, silicon solar-cells were fabricated by using as-sawn wafers having different depth of saw damage without any damaged etching process. The damaged layer induced by wire-sawing process in silicon bulk intensely influenced the value of fill factor on solar cells, degrading fill factor to 57.20%. In addition, the photovoltaic characteristics of solar cells applying texturing process shows that although the initial depth of saw-damage induced by wire-sawing process was different, the value of short-circuit current, fill-factor, and power-conversion-efficiency have an almost same, showing ~17.4% of cell efficiency. It indicated that the degradation of solar-cell efficiency induced by wire-sawing process could be prevented by eliminating all damaged layer through sufficient pyramid-surface texturing process.

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      목차 (Table of Contents)

      • ABSTRACT
      • 1. 서론
      • 2. 실험
      • 3. 결과 및 고찰
      • 4. 결론
      • ABSTRACT
      • 1. 서론
      • 2. 실험
      • 3. 결과 및 고찰
      • 4. 결론
      • References
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      참고문헌 (Reference)

      1 X. Yu, "Thin Czochralski silicon solar cells based on diamond wire sawing technology" 98 : 337-342, 2012

      2 B. Sopori, "Surface characteristics and damage distributions of diamond wire sawn wafers for silicon solar cells" 3 (3): 669-685, 2016

      3 M. A. Green, "Solar cell efficiency tables(version 50)" 25 : 668-676, 2017

      4 J. M. Kim, "Saw-damage-induced structural defects on the surface of silicon crystals" 152 (152): G189-G192, 2005

      5 W. Chen, "On the nature and removal of saw marks on diamond wire sawn multicrystalline silicon wafers" 27 : 220-227, 2014

      6 K. Chen, "Novel texturing process for diamond-wire-sawn single-crystalline silicon solar cell" 133 : 148-155, 2015

      7 H. J. Moller, "Multicrystalline silicon for solar cells" 487 : 179-187, 2005

      8 P. Fath, "Mechanical wafer engineering for high efficiency solar cells : an investigation of the induced surface damage" 2 : 1347-1350, 1994

      9 C. W. Hardin, "Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers" 19 (19): 355-367, 2004

      10 A. Kumar, "Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers" 364 : 163-168, 2016

      1 X. Yu, "Thin Czochralski silicon solar cells based on diamond wire sawing technology" 98 : 337-342, 2012

      2 B. Sopori, "Surface characteristics and damage distributions of diamond wire sawn wafers for silicon solar cells" 3 (3): 669-685, 2016

      3 M. A. Green, "Solar cell efficiency tables(version 50)" 25 : 668-676, 2017

      4 J. M. Kim, "Saw-damage-induced structural defects on the surface of silicon crystals" 152 (152): G189-G192, 2005

      5 W. Chen, "On the nature and removal of saw marks on diamond wire sawn multicrystalline silicon wafers" 27 : 220-227, 2014

      6 K. Chen, "Novel texturing process for diamond-wire-sawn single-crystalline silicon solar cell" 133 : 148-155, 2015

      7 H. J. Moller, "Multicrystalline silicon for solar cells" 487 : 179-187, 2005

      8 P. Fath, "Mechanical wafer engineering for high efficiency solar cells : an investigation of the induced surface damage" 2 : 1347-1350, 1994

      9 C. W. Hardin, "Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers" 19 (19): 355-367, 2004

      10 A. Kumar, "Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers" 364 : 163-168, 2016

      11 H. Seogneur, "Effect of diamond wire saw marks on solar cell performance" 92 : 386-391, 2016

      12 B. Sopori, "Characterizing damage on si wafer surfaces cut by slurry and diamond wire sawing" 0945-0950, 2013

      13 N. Watanabe, "Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wire" 18 : 485-490, 2010

      14 A. Louwen, "A cost roadmap for silicon heterojunction solar cells" 147 : 295-314, 2016

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