반도체 공정용 저온 열처리로의 고효율 냉각시스템 설계에 관한 연구 = Study on Design of high Efficient Cooling System for Low Temperature Furnace in Semiconductor Processing

다국어 초록 (Multilingual Abstract)

According to recent changes in industry for semiconductor devices, a low-temperature treatment has become a necessity. These changes relate to size refinement and the development of new materials. While variation in cooling efficiency does not affect the yield when using a high-temperature treatment, uniform cooling efficiency is necessary avoid "inconsistencies/bends" in low temperature treatments. However it is difficult to increase temperature stabilization in low temperature treatments. In this paper, using CFD (Computer Fluid Dynamics), we analyze and manipulate the design and input of the low-temperature system to attempt to control for temperature variations within the quartz tube, of which airflow appears to be a predominant factor. This simulation includes variable inputs such as airflow rate, head pressure, and design manipulations in the S.C.U. (Super Cooling Unit).

참고문헌 (Reference)

1 진홍종, "고로하부 액체유동에 대한 수치해석 사례 - 냉간유동" 한국연소학회 13 (13): 33-41, 2008

2 J. Wang, "Real-Time Furnace Modeling and Diagnostics" 15 (15): 393-402, 2002

3 D. I. Seol, "Heat Transfer Analysis in High Efficiency Electric Melting Furnace" KSME 1626-1631, 2007

4 E. S. Jeong, "A study of Optimal Distribution of Gas Temperature in Directly-Fired Reheating Furnace" KSME 2122-2125, 2008

5 D. S. Han, "A Numerical Study on Prediction of Internal Temperature in Electronic Melting Furnace with Thermal Characteristics Effect" 514-522, 2008