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    전송선로 행열을 이용한 전력배분기판에 대한 빠른 임피던스 계산 방법 = A Fast Computation Algorithm for the Impedance calculation of the Power Distribution Plane Using the Transmission Matrix

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    https://www.riss.kr/link?id=A104285525

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    다국어 초록 (Multilingual Abstract) kakao i 다국어 번역

    An impedance calculation method for the irregular shaped power distribution networks is presented. The irregular shaped metal-dielectric-metal board is split into three piece of segments to calculate the impedance between the two separated points on the board. Transmission-matrix description corresponding to the unit column of board and the connection of unit column board are introduced. Then the transmission-matrix for the each segment is calculated and reduced to the 2-ports impedance matrix. The proposed algorithm is very fast comparing the existing methods. Applied to the 6 inch by 5 inch size irregular shaped board, the proposed method shows 15 times faster than the electromagnetic or circuit analysis method.
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    An impedance calculation method for the irregular shaped power distribution networks is presented. The irregular shaped metal-dielectric-metal board is split into three piece of segments to calculate the impedance between the two separated points on t...

    An impedance calculation method for the irregular shaped power distribution networks is presented. The irregular shaped metal-dielectric-metal board is split into three piece of segments to calculate the impedance between the two separated points on the board. Transmission-matrix description corresponding to the unit column of board and the connection of unit column board are introduced. Then the transmission-matrix for the each segment is calculated and reduced to the 2-ports impedance matrix. The proposed algorithm is very fast comparing the existing methods. Applied to the 6 inch by 5 inch size irregular shaped board, the proposed method shows 15 times faster than the electromagnetic or circuit analysis method.

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    참고문헌 (Reference)

    1 I. Novak, "Reducing Simultaneous Switching Noise and EMI on Ground/Power Planes by Dissipative Edge Termination" 22 (22): 274-283, 1999

    2 K. Lee, "Modeling and Analysis of Multichip Module Power Supply Planes" 18 (18): 628-639, 1995

    3 D. G. Swanson, "Microwave Circuit Modeling Using Electromagnetic Field Simulation" Artech House 2003

    4 G.-T. Lei, "High Frequency Characterization of Power/Ground-Plane Structures" 47 (47): 562-569, 1999

    1 I. Novak, "Reducing Simultaneous Switching Noise and EMI on Ground/Power Planes by Dissipative Edge Termination" 22 (22): 274-283, 1999

    2 K. Lee, "Modeling and Analysis of Multichip Module Power Supply Planes" 18 (18): 628-639, 1995

    3 D. G. Swanson, "Microwave Circuit Modeling Using Electromagnetic Field Simulation" Artech House 2003

    4 G.-T. Lei, "High Frequency Characterization of Power/Ground-Plane Structures" 47 (47): 562-569, 1999

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    학술지 이력

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    연월일 이력구분 이력상세 등재구분
    2007-01-01 등재 학술지 통합(등재유지)
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