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      KCI등재 SCI SCIE SCOPUS

      Effect of Shield Line on Noise Margin and Refresh Time of Planar DRAM Cell for Embedded Application

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      다국어 초록 (Multilingual Abstract)

      In this paper we investigate the effect of a shield metal
      line inserted between adjacent bit lines on the refresh time
      and noise margin in a planar DRAM cell. The DRAM cell
      consists of an access transistor, which is biased to 2.5V
      during operation, and an NMOS capacitor having the
      capacitance of 10fF per unit cell and a cell size of 3.63 μm2.
      We designed a 1Mb DRAM with an open bit-line
      structure. It appears that the refresh time is increased
      from 4.5 ms to 12 ms when the shield metal line is inserted.
      Also, it appears that no failure occurs when Vcc is
      increased from 2.2 V to 3 V during a bump up test, while it
      fails at 2.8 V without a shield metal line. Raphael
      simulation reveals that the coupling noise between
      adjacent bit lines is reduced to 1/24 when a shield metal
      line is inserted, while total capacitance per bit line is
      increased only by 10%.
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      In this paper we investigate the effect of a shield metal line inserted between adjacent bit lines on the refresh time and noise margin in a planar DRAM cell. The DRAM cell consists of an access transistor, which is biased to 2.5V during operation, an...

      In this paper we investigate the effect of a shield metal
      line inserted between adjacent bit lines on the refresh time
      and noise margin in a planar DRAM cell. The DRAM cell
      consists of an access transistor, which is biased to 2.5V
      during operation, and an NMOS capacitor having the
      capacitance of 10fF per unit cell and a cell size of 3.63 μm2.
      We designed a 1Mb DRAM with an open bit-line
      structure. It appears that the refresh time is increased
      from 4.5 ms to 12 ms when the shield metal line is inserted.
      Also, it appears that no failure occurs when Vcc is
      increased from 2.2 V to 3 V during a bump up test, while it
      fails at 2.8 V without a shield metal line. Raphael
      simulation reveals that the coupling noise between
      adjacent bit lines is reduced to 1/24 when a shield metal
      line is inserted, while total capacitance per bit line is
      increased only by 10%.

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      참고문헌 (Reference)

      1 H. Hidaka,, "Twisted Bit-Line Architecture for Multi-MegabitDRAM’s" 26 (26): 21-28, December2004

      2 S. Lee, "Pipelined Macroblock Processing to Reduce InternalBuffer Size of Motion Estimation in Multimedia SoCs" 25 (25): 297-304, Oct.2003

      3 Dong-Sun Min, "Multiple Twisted Dataline Techniques for MultigigabitDRAM’s" 34 : 856-865, 1999

      4 W. Leung, "Method and Apparatus for CompleteHiding of the Refresh of a Semiconductor Memory" 999 : 474-, 1999

      5 Y.J. Kim,, "Investigation of aRelationship between Refresh Time and Implantation Overlap inCapacitor Region of P-MOS DRAM Cell" 71 : 262-265, 2004

      6 D.H. Suh,, "Characterization of 3 Dimensional Capacitor Preparedby Oxide Recess in Shallow Trench Isolation" in press

      7 M. Aoki,, "An Experimental 16-MbitDRAM with Transposed Data Line Structure" 250-251, 1998

      8 M. Hashimoto,, "An Embedded DRAMModule Using a Dual Sense Amplifier Architecture in a LogicProcess" 64-65, 1997

      9 D.H. Suh, "A Process Technology for 0.16μmEmbedded DRAM with Fast Logic Speed and Small DRAMCell" 151 : 618-622, 2004

      10 W. Kim, "A Platform-Based SoC Design of a 32-Bit Smart Card" 25 (25): 510-516, Dec.2003

      1 H. Hidaka,, "Twisted Bit-Line Architecture for Multi-MegabitDRAM’s" 26 (26): 21-28, December2004

      2 S. Lee, "Pipelined Macroblock Processing to Reduce InternalBuffer Size of Motion Estimation in Multimedia SoCs" 25 (25): 297-304, Oct.2003

      3 Dong-Sun Min, "Multiple Twisted Dataline Techniques for MultigigabitDRAM’s" 34 : 856-865, 1999

      4 W. Leung, "Method and Apparatus for CompleteHiding of the Refresh of a Semiconductor Memory" 999 : 474-, 1999

      5 Y.J. Kim,, "Investigation of aRelationship between Refresh Time and Implantation Overlap inCapacitor Region of P-MOS DRAM Cell" 71 : 262-265, 2004

      6 D.H. Suh,, "Characterization of 3 Dimensional Capacitor Preparedby Oxide Recess in Shallow Trench Isolation" in press

      7 M. Aoki,, "An Experimental 16-MbitDRAM with Transposed Data Line Structure" 250-251, 1998

      8 M. Hashimoto,, "An Embedded DRAMModule Using a Dual Sense Amplifier Architecture in a LogicProcess" 64-65, 1997

      9 D.H. Suh, "A Process Technology for 0.16μmEmbedded DRAM with Fast Logic Speed and Small DRAMCell" 151 : 618-622, 2004

      10 W. Kim, "A Platform-Based SoC Design of a 32-Bit Smart Card" 25 (25): 510-516, Dec.2003

      11 Y.H. Park,, "A 7.1 GB/s Low-Power Rendering Engine in 2D Array Embedded Memory LogicCMOS for Portable Multimedia System" 36 : 944-955, 2001

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      공동연구자 (7)

      유사연구자 (20) 활용도상위20명

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
      2020-01-01 평가 등재학술지 유지 (해외등재 학술지 평가) KCI등재
      2005-09-27 학술지등록 한글명 : ETRI Journal
      외국어명 : ETRI Journal
      KCI등재
      2003-01-01 평가 SCI 등재 (신규평가) KCI등재
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      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 0.78 0.28 0.57
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.47 0.42 0.4 0.06
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