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あぁかがさざただなはばぱまやゃらわゎんいぃきぎしじちぢにひびぴみりうぅくぐすずつづっぬふぶぷむゆゅるえぇけげせぜてでねへべぺめれおぉこごそぞとどのほぼぽもよょろを

アァカサザタダナハバパマヤャラワヮンイィキギシジチヂニヒビピミリウゥクグスズツヅッヌフブプムユュルエェケゲセゼテデヘベペメレオォコゴソゾトドノホボポモヨョロヲ ―

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Ä Ö Ü ä ö ü ß

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½ ⅓ ⅔ ¼ ¾ ⅛ ⅜ ⅝ ⅞ ¹ ² ³ ⁴ ⁿ ₁ ₂ ₃ ₄

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ا ب ت ث ج ح خ د ذ ر ز س ش ص ض ط ظ ع غ ف ق ک ل م ن ه و ی

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RISS 인기검색어

금속과 세라믹기판의 접착력에 미치는 초음파 교반의 영향에 관한 연구 = A study on the effect of ultrasonic agitation for adhesion strength between metal and ceramic boards

한글로보기

https://www.riss.kr/link?id=A40005721

저자

추현식 (조선대학교 공과대학 금속공학과) ; 류일광 (조선대학교 공과대학 금속공학과)
발행기관
조선대학교 생산기술연구소
학술지명
生産技術硏究
권호사항

Vol.20 No.2 [1998]
발행연도
1998
작성언어
Korean
KDC
505
자료형태
학술저널
수록면

115-123(9쪽)
제공처
RISS
소장기관
- 경운대학교 벽강중앙도서관

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다국어 초록 (Multilingual Abstract)

Recently, ceramic substrate is selected for an alternative substrate board for high-speed circuits due to its low-thermal expansion. Generally, metallization of ceramic substrate is fabricated by electroless copper plating. But it has been troubled for its weak adhesion strength between the ceramic board and copper layers. To enhance adhesion strength, we have studied effects of ultrasonic agitation for adhesion strength between metal and ceramic boards. In catalyst treatment, high density Pd nuclei of small size were formed during ultrasonic agitation compared that of no stirring. In this case, the adhesion strength was enhanced about 20% by using ultrasonic agitation.

번역하기

Recently, ceramic substrate is selected for an alternative substrate board for high-speed circuits due to its low-thermal expansion. Generally, metallization of ceramic substrate is fabricated by electroless copper plating. But it has been troubled fo...

Recently, ceramic substrate is selected for an alternative substrate board for high-speed circuits due to its low-thermal expansion. Generally, metallization of ceramic substrate is fabricated by electroless copper plating. But it has been troubled for its weak adhesion strength between the ceramic board and copper layers. To enhance adhesion strength, we have studied effects of ultrasonic agitation for adhesion strength between metal and ceramic boards. In catalyst treatment, high density Pd nuclei of small size were formed during ultrasonic agitation compared that of no stirring. In this case, the adhesion strength was enhanced about 20% by using ultrasonic agitation.