Patterning of Thin Copper Films under UV Exposure in Chlorine-Based Liquids

다국어 초록 (Multilingual Abstract)

Wet etching of thin copper films was achieved by using chlorine-based liquids, such as 1,2-
dicholorethane or NaCl dissolved in water, under ultraviolet (UV) irradiation. The etching of
the thin copper film was probed in-situ by using a spectroscopic ellipsometer, and the etch rate
could be controlled by adjusting the exposure parameters. As UV is used in lithography, mask
patterns can be transferred to a copper surface directly without resorting to a complex photoresist
process. Easy control of the etch rate ranging from sub °A/s and use of nontoxic liquids such as
1,2-dicholoroethane and NaCl solution are major advantages of this novel technique.

참고문헌 (Reference)

1 "Semiconductor Devices, Phy. & Tech.2nd ed." Wiley 442-, 2001

2 "Handbook of Optical Constants of Solids" Academic Press 284-, 1998