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      KCI등재 SCOPUS SCIE

      Toughening of Epoxy Resin System Using a Novel Dendritic Polysiloxane

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      https://www.riss.kr/link?id=A104690582

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      다국어 초록 (Multilingual Abstract)

      Dendritic polymers have attracted increasing attention in the field of epoxy resin toughening. This paper is the first report of the use of a novel dendritic polysiloxane (DPSO) bearing high epoxide groups to modify the diglycidyl ether of bisphenol-A (DGEBA). The thermal properties, toughness and morphology of the cured epoxy resins were examined by DSC, TGA, impact testing and SEM. The chemical structure of DPSO was confirmed by FTIR, 29Si NMR and GPC. The Tg increased by approximately 7 oC after introducing the DPSO. The TGA results under N2 and air atmospheres showed that the initial degradation temperature for 5% weight loss (Td 5%), temperature for 50% weight loss (Td 50%) and residual weight percent at 800 oC (R800) all increased after introducing DPSO.
      Moreover, the addition of 3 phr DPSO100 resulted in a 70.4% increase in impact strength compared to that of the neat epoxy. The morphology of the fracture surfaces shows that the miscibility of polysiloxane with epoxy resin increased with increasing number of epoxy groups in DPSO, and the improved toughness was attributed to the rubber-bridged effect. The high number of epoxy groups in dendritic polysiloxane can react during the curing process,and participate chemically in the crosslinking network. DPSO is expected to improve significantly the toughness and thermal stability of epoxy resin.
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      Dendritic polymers have attracted increasing attention in the field of epoxy resin toughening. This paper is the first report of the use of a novel dendritic polysiloxane (DPSO) bearing high epoxide groups to modify the diglycidyl ether of bisphenol-A...

      Dendritic polymers have attracted increasing attention in the field of epoxy resin toughening. This paper is the first report of the use of a novel dendritic polysiloxane (DPSO) bearing high epoxide groups to modify the diglycidyl ether of bisphenol-A (DGEBA). The thermal properties, toughness and morphology of the cured epoxy resins were examined by DSC, TGA, impact testing and SEM. The chemical structure of DPSO was confirmed by FTIR, 29Si NMR and GPC. The Tg increased by approximately 7 oC after introducing the DPSO. The TGA results under N2 and air atmospheres showed that the initial degradation temperature for 5% weight loss (Td 5%), temperature for 50% weight loss (Td 50%) and residual weight percent at 800 oC (R800) all increased after introducing DPSO.
      Moreover, the addition of 3 phr DPSO100 resulted in a 70.4% increase in impact strength compared to that of the neat epoxy. The morphology of the fracture surfaces shows that the miscibility of polysiloxane with epoxy resin increased with increasing number of epoxy groups in DPSO, and the improved toughness was attributed to the rubber-bridged effect. The high number of epoxy groups in dendritic polysiloxane can react during the curing process,and participate chemically in the crosslinking network. DPSO is expected to improve significantly the toughness and thermal stability of epoxy resin.

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      참고문헌 (Reference)

      1 G. Beaucage, 29 : 8349-, 1996

      2 M. Gonzalez, 45 : 5533-, 2004

      3 S. Kunz-Douglass, 15 : 1109-, 1980

      4 J. M. Barton, 8 : 25-, 1974

      5 P. G. Liu, 44 : 940-, 2008

      6 M. Alagar, 53 : 45-, 2004

      7 A. A. Prabu, 42 : 175-, 2005

      8 S. T. Lin, 34 : 1907-, 1996

      9 J. Y. Shieh, 224 : 21-, 1995

      10 S. S. Lee, 64 : 941-, 1997

      1 G. Beaucage, 29 : 8349-, 1996

      2 M. Gonzalez, 45 : 5533-, 2004

      3 S. Kunz-Douglass, 15 : 1109-, 1980

      4 J. M. Barton, 8 : 25-, 1974

      5 P. G. Liu, 44 : 940-, 2008

      6 M. Alagar, 53 : 45-, 2004

      7 A. A. Prabu, 42 : 175-, 2005

      8 S. T. Lin, 34 : 1907-, 1996

      9 J. Y. Shieh, 224 : 21-, 1995

      10 S. S. Lee, 64 : 941-, 1997

      11 M. Gonzalez, 45 : 5533-, 2004

      12 M. Jang, 41 : 3056-, 2003

      13 S. S. Hou, 41 : 3263-, 2000

      14 Y. Morita, 97 : 946-, 2005

      15 M. Ochi, 41 : 195-, 2000

      16 W. C. Shih, 73 : 2739-, 1999

      17 K. U. Chun-Kang, 48 : 3-, 2007

      18 L. Könczöl, 54 : 815-, 1994

      19 Q. P. Guo, 44 : 3042-, 2006

      20 W. Gong, 49 : 3318-, 2008

      21 S. T. Lin, 34 : 1907-, 1996

      22 L. Boogh, 40 : 2249-, 1999

      23 R. J. Varley, 53 : 78-, 2004

      24 R. J. Varley, 53 : 69-, 2004

      25 D. P. Dworak, 37 : 9402-, 2004

      26 M. H. Hou, 39 : 696-, 2007

      27 S.-S. Hou, 41 : 3263-, 2000

      28 S. Ahmad, 100 : 4981-, 2006

      29 Z. K. Chen, 50 : 1316-, 2009

      30 M. Zhang, "http://writing.syr.edu/~cslipson/419619/LiteratureReviewrevised.pdf"

      31 SangHoLee, "Synthesis and Characterization of a New Photoconducting Poly(siloxane) Having Pendant Diphenylhydrazone for Photorefractive Applications" 한국고분자학회 11 (11): 431-436, 2003

      32 Byoung Gak Kim, "Polysiloxanes Containing Alkyl Side Groups: Synthesis and Mesomorphic Behavior" 한국고분자학회 16 (16): 36-44, 2008

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      공동연구자 (7)

      유사연구자 (20) 활용도상위20명

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
      2020-01-01 평가 등재학술지 유지 (해외등재 학술지 평가) KCI등재
      2012-06-04 학술지명변경 외국어명 : 미등록 -> Macromolecular Research KCI등재
      2008-01-01 평가 SCI 등재 (등재유지) KCI등재
      2006-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2004-01-01 평가 등재학술지 유지 (등재유지) KCI등재
      2001-07-01 평가 등재학술지 선정 (등재후보2차) KCI등재
      1999-01-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
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      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 1.4 0.33 0.97
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      0.75 0.62 0.296 0.21
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