무전해 도금법을 이용한 Sn-Cu 범프 형성에 관한 연구 = Fabrication of Sn-Cu Bump using Electroless Plating Method

다국어 초록 (Multilingual Abstract)

The electroless plating of copper and tin were investigated for the fabrication of Sn-Cu bump. Copper and tin were electroless plated in series on $20{\mu}m$ diameter copper via to form approximately $10{\mu}m$ height bump. In electroless copper plating, acid cleaning and stabilizer addition promoted the selectivity of bath on the copper via. In electroless tin plating, the coating thickness of tin was less uniform relative to that of electroless copper, however the size of Sn-Cu bump were uniform after reflow process.

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