소형컴퓨터용 열사이펀 냉각기의 성능평가 및 가시화 = Performance Evaluation and Visualization Thermosyphon Cooler for Desktop PC

다국어 초록 (Multilingual Abstract)

The performance characteristics of the thermosyphon cooler made of Pyrex glass are studied. The evaporator and the condenser of the thermosyphon are separated by two pipe lines. Entrance of the vapor line in the condenser is about 20 mm higher than the liquid line. Due to this configuration, the condensed liquid returned to the condenser through the liquid line by means of gravity. Water by 10, 20, and 50% of the evaporator volume are filled in the system at the pressure of 0.1 Torr. The evaporator is heated by the flat electric heater. The heat transfer rate at the condenser is measured by the water jacket calorimeter.
For the range of the experiment, dry-out limit, flooding limit, and choking limits are not seen. The temperature fluctuations at the evaporator bottom are observed and it can be another important limit. Observed phenomena at the evaporator are natural convection boiling, pulsed boiling, and transition. Also, it is observed that the dropwise condensation at the condenser and at the liquid and vapor line, liquid column fluctuation at the liquid and vapor line, and sputtering. All these phenomena can be identified at transient temperature response signal recorded by the data acquisition unit.
The capacities of the evaporator and the condenser are tested with/without insulation by varying the filling ratio, heating rate, the coolant temperature of the condenser. The bottom surface temperatures of the evaporator show the following tendencies; it increases as the heating rate increase, as the coolant temperature increases; it is higher at the without insulation case than with insulation case. The lowest bottom surface temperature and less temperature fluctuation are observed at the filing ratio of 50% with insulation case.

목차 (Table of Contents)

• I. 서론
• II. 실험장치 및 방법
• III. 실험결과 및 고찰
• 1. 증발부 하부온도
• 1) 충전율 20%
• 2) 충전율 10%
• 3) 충전율 50%
• 2. 충전율 변화에 따른 증발부 하부온도 비교
• 3. 충전율 변화에 따른 열저항 비교
• IV. 결 론