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    유연 디스플레이용 무색 투명 폴리이미드 필름의 굽힘 잔류 변형률 평가 = Evaluation of Residual Strains under Pure Bending Loading for Colorless and Optically Transparent Polyimide Film for Flexible Display

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    https://www.riss.kr/link?id=A108065557

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    다국어 초록 (Multilingual Abstract) kakao i 다국어 번역

    The display industry is transitioning from traditional rigid products such as flat panel displays to flexible or wearable ones designed to be folded or rolled. Accordingly, colorless and optically transparent polyimide (CPI) films are one of the prime candidates to substitute traditional cover glass as a passivation layer to accommodate product flexibility. However, CPI films subjected to repetitive pure bending loads inevitably entail an accumulation of residual strain that can eventually cause wrinkles or delamination in the underlying component after a certain number of static and cyclic loading. The purpose of this study is to establish an experimental method to systematically evaluate the bending residual strain of CPI films. Films were monotonically and cyclically wrapped on mandrels of various diameters to ensure a constant strain in each. After unwrapping the wound CPI film, the residual radius of curvature remaining on the film was measured and converted into residual strain. The critical radius of curvature at which residual strain does not remain was about 5 mm, and the residual strain decreased in proportion to the log time. It is expected that flexible displays can be reliably designed using the data between the applied bending strain and the residual strain.
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    The display industry is transitioning from traditional rigid products such as flat panel displays to flexible or wearable ones designed to be folded or rolled. Accordingly, colorless and optically transparent polyimide (CPI) films are one of the prime...

    The display industry is transitioning from traditional rigid products such as flat panel displays to flexible or wearable ones designed to be folded or rolled. Accordingly, colorless and optically transparent polyimide (CPI) films are one of the prime candidates to substitute traditional cover glass as a passivation layer to accommodate product flexibility. However, CPI films subjected to repetitive pure bending loads inevitably entail an accumulation of residual strain that can eventually cause wrinkles or delamination in the underlying component after a certain number of static and cyclic loading. The purpose of this study is to establish an experimental method to systematically evaluate the bending residual strain of CPI films. Films were monotonically and cyclically wrapped on mandrels of various diameters to ensure a constant strain in each. After unwrapping the wound CPI film, the residual radius of curvature remaining on the film was measured and converted into residual strain. The critical radius of curvature at which residual strain does not remain was about 5 mm, and the residual strain decreased in proportion to the log time. It is expected that flexible displays can be reliably designed using the data between the applied bending strain and the residual strain.

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    참고문헌 (Reference)

    1 Park, J. -S., "Thin film encapsulation for flexible AM-OLED : a review" 26 : 034001-, 2011

    2 Kim, J.-H, "The effect of anisotropic conductive films adhesion on the bending reliability of chip-in-flex packages for wearable electronics applications" 7 (7): 1583-1591, 2017

    3 Yang, Z., "Synthesis and characterization of amide-bridged colorless polyimide films with low CTE and high optical performance for flexible OLED displays" 12 : 5364-5376, 2021

    4 Cuddalorepatta, G.K, "Residual stress–driven test technique for freestanding ultrathin films: Elastic behavior and residual strain" 34 (34): 3474-3482, 2019

    5 Shi, S., "Research on Commercial Foldable AMOLED and Relevant Technologies" 51 : 826-829, 2020

    6 Tapaswi, P.K, "Recent trends on transparent colorless polyimides with balanced thermal and optical properties : design and synthesis" 220 : 1800313-, 2019

    7 Jeong, J.-H, "Quantitative evaluation of bending reliability for a flexible near-field communication tag" 75 : 121-126, 2017

    8 Kallmayer, C, "New Materials and Processes for Flexible Electronics"

    9 Chang, C.-L, "Flexible cover window with colorless polyimide hard coating thin film for foldable displays" 52 (52): 961-964, 2021

    10 Koo, J. H., "Flexible and stretchable smart display : materials, fabrication, device design, and system integration" 28 : 1801834-, 2018

    1 Park, J. -S., "Thin film encapsulation for flexible AM-OLED : a review" 26 : 034001-, 2011

    2 Kim, J.-H, "The effect of anisotropic conductive films adhesion on the bending reliability of chip-in-flex packages for wearable electronics applications" 7 (7): 1583-1591, 2017

    3 Yang, Z., "Synthesis and characterization of amide-bridged colorless polyimide films with low CTE and high optical performance for flexible OLED displays" 12 : 5364-5376, 2021

    4 Cuddalorepatta, G.K, "Residual stress–driven test technique for freestanding ultrathin films: Elastic behavior and residual strain" 34 (34): 3474-3482, 2019

    5 Shi, S., "Research on Commercial Foldable AMOLED and Relevant Technologies" 51 : 826-829, 2020

    6 Tapaswi, P.K, "Recent trends on transparent colorless polyimides with balanced thermal and optical properties : design and synthesis" 220 : 1800313-, 2019

    7 Jeong, J.-H, "Quantitative evaluation of bending reliability for a flexible near-field communication tag" 75 : 121-126, 2017

    8 Kallmayer, C, "New Materials and Processes for Flexible Electronics"

    9 Chang, C.-L, "Flexible cover window with colorless polyimide hard coating thin film for foldable displays" 52 (52): 961-964, 2021

    10 Koo, J. H., "Flexible and stretchable smart display : materials, fabrication, device design, and system integration" 28 : 1801834-, 2018

    11 Yu, X. -H., "Colorless PI structure design and evaluation for achieving low CTE target" 21 : 100562-, 2019

    12 Wisinger, C. E., "Bending, curling, and twisting in polymeric bilayers" 15 : 4541-4547, 2019

    13 Saleh, R, "Bending setups for reliability investigation of flexible electronics" 12 : 78-, 2021

    14 Khan, M.U.A, "Bending analysis of polymer-based flexible antennas for wearable, general IoT applications : A review" 13 : 357-, 2021

    15 Yang, S.-Y., "Advanced Polyimide Materials" Elsevier: Chemical Industry Press 1-66, 2018

    16 "ASTM D522 / D522M-17, Standard Test Methods for Mandrel Bend Test of Attached Organic Coatings" ASTM International

    17 정은교, "A review of highly reliable flexible encapsulation technologies towards rollable and foldable OLEDs" 한국정보디스플레이학회 21 (21): 19-32, 2020

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    학술지 이력

    학술지 이력
    연월일 이력구분 이력상세 등재구분
    2027 평가 재인증평가 신청대상 (재인증)
    2021-01-01 등재 등재학술지 유지 (재인증) KCI등재
    2019-01-01 등재 등재학술지 유지 (계속평가) KCI등재
    2016-01-01 등재 등재학술지 유지 (계속평가) KCI등재
    2012-01-01 등재 등재학술지 유지 (등재유지) KCI등재
    2010-03-25 학회명변경 한글명 : 한국반도체및디스플레이장비학회 -> 한국반도체디스플레이기술학회
    영문명 : The Korean Society of Semiconductor & Display Equipment Technology -> The Korean Society of Semiconductor & Display Technology
    KCI등재
    2010-03-25 학술지명변경 한글명 : 반도체및디스플레이장비학회지 -> 반도체디스플레이기술학회지
    외국어명 : Journal of the Semiconductor and Display Equipment Technology -> Journal of the Semiconductor & Display Technology
    KCI등재
    2009-01-01 등재 등재학술지 선정 (등재후보2차) KCI등재
    2008-01-01 등재 등재후보 1차 PASS (등재후보1차) KCI등재후보
    2006-01-01 등재 등재후보학술지 선정 (신규평가) KCI등재후보
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    학술지 인용정보

    학술지 인용정보
    기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
    2016 0.29 0.29 0.26
    KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
    0.21 0.18 0.217 0.02
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