1 Park, J. -S., "Thin film encapsulation for flexible AM-OLED : a review" 26 : 034001-, 2011
2 Kim, J.-H, "The effect of anisotropic conductive films adhesion on the bending reliability of chip-in-flex packages for wearable electronics applications" 7 (7): 1583-1591, 2017
3 Yang, Z., "Synthesis and characterization of amide-bridged colorless polyimide films with low CTE and high optical performance for flexible OLED displays" 12 : 5364-5376, 2021
4 Cuddalorepatta, G.K, "Residual stress–driven test technique for freestanding ultrathin films: Elastic behavior and residual strain" 34 (34): 3474-3482, 2019
5 Shi, S., "Research on Commercial Foldable AMOLED and Relevant Technologies" 51 : 826-829, 2020
6 Tapaswi, P.K, "Recent trends on transparent colorless polyimides with balanced thermal and optical properties : design and synthesis" 220 : 1800313-, 2019
7 Jeong, J.-H, "Quantitative evaluation of bending reliability for a flexible near-field communication tag" 75 : 121-126, 2017
8 Kallmayer, C, "New Materials and Processes for Flexible Electronics"
9 Chang, C.-L, "Flexible cover window with colorless polyimide hard coating thin film for foldable displays" 52 (52): 961-964, 2021
10 Koo, J. H., "Flexible and stretchable smart display : materials, fabrication, device design, and system integration" 28 : 1801834-, 2018
1 Park, J. -S., "Thin film encapsulation for flexible AM-OLED : a review" 26 : 034001-, 2011
2 Kim, J.-H, "The effect of anisotropic conductive films adhesion on the bending reliability of chip-in-flex packages for wearable electronics applications" 7 (7): 1583-1591, 2017
3 Yang, Z., "Synthesis and characterization of amide-bridged colorless polyimide films with low CTE and high optical performance for flexible OLED displays" 12 : 5364-5376, 2021
4 Cuddalorepatta, G.K, "Residual stress–driven test technique for freestanding ultrathin films: Elastic behavior and residual strain" 34 (34): 3474-3482, 2019
5 Shi, S., "Research on Commercial Foldable AMOLED and Relevant Technologies" 51 : 826-829, 2020
6 Tapaswi, P.K, "Recent trends on transparent colorless polyimides with balanced thermal and optical properties : design and synthesis" 220 : 1800313-, 2019
7 Jeong, J.-H, "Quantitative evaluation of bending reliability for a flexible near-field communication tag" 75 : 121-126, 2017
8 Kallmayer, C, "New Materials and Processes for Flexible Electronics"
9 Chang, C.-L, "Flexible cover window with colorless polyimide hard coating thin film for foldable displays" 52 (52): 961-964, 2021
10 Koo, J. H., "Flexible and stretchable smart display : materials, fabrication, device design, and system integration" 28 : 1801834-, 2018
11 Yu, X. -H., "Colorless PI structure design and evaluation for achieving low CTE target" 21 : 100562-, 2019
12 Wisinger, C. E., "Bending, curling, and twisting in polymeric bilayers" 15 : 4541-4547, 2019
13 Saleh, R, "Bending setups for reliability investigation of flexible electronics" 12 : 78-, 2021
14 Khan, M.U.A, "Bending analysis of polymer-based flexible antennas for wearable, general IoT applications : A review" 13 : 357-, 2021
15 Yang, S.-Y., "Advanced Polyimide Materials" Elsevier: Chemical Industry Press 1-66, 2018
16 "ASTM D522 / D522M-17, Standard Test Methods for Mandrel Bend Test of Attached Organic Coatings" ASTM International
17 정은교, "A review of highly reliable flexible encapsulation technologies towards rollable and foldable OLEDs" 한국정보디스플레이학회 21 (21): 19-32, 2020