1 이재익, "플렉서블 디스플레이 R&D기술 디자인 융합연구" 한국전시산업융합연구원 18 : 519-529, 2014
2 최정열, "웨어러블 패키징용 Polydimethylsiloxane (PDMS) 신축성 기판의 강성도 변화거동" 한국마이크로전자및패키징학회 21 (21): 125-131, 2014
3 배상진, "모바일 디스플레이산업 분석" 한국기술혁신학회 5 (5): 396-411, 2002
4 최정열, "SnBi 저온솔더의 플립칩 본딩을 이용한 스마트 의류용 칩 접속공정" 한국마이크로전자및패키징학회 19 (19): 71-76, 2012
5 C. Y. Lim, "Mechanical and Electrical Stability IndiumTin-Oxide Coated Polymer Substrates under Continuous Bending Stress Condition" 2 (2): 237-, 2012
6 T. C. Li, "Fatigue life study of ITO/PET specimens in cyclic bending tests" 26 (26): 250-, 2015
7 T. C. Li, "Fatigue Life Study of ITO/PET Specimens in Terms of Electrical Resistance and Stress/Strain Via Cyclic Bending Tests" 9 (9): 577-, 2013
8 S. H. Choa, "Experimental Study for Improving Mechanical Reliability of Flexible ITO Films" 3205 : 2011
9 J. K. Yang, "Effect of twisting fatigue on the electrical reliability of a metal interconnect on a flexible substrate" 2017 : 422-, 2017
10 K. Alzoubi, "Bending Fatigue Study of Sputtered ITO on Flexible Substrate" 7 (7): 593-, 2011
1 이재익, "플렉서블 디스플레이 R&D기술 디자인 융합연구" 한국전시산업융합연구원 18 : 519-529, 2014
2 최정열, "웨어러블 패키징용 Polydimethylsiloxane (PDMS) 신축성 기판의 강성도 변화거동" 한국마이크로전자및패키징학회 21 (21): 125-131, 2014
3 배상진, "모바일 디스플레이산업 분석" 한국기술혁신학회 5 (5): 396-411, 2002
4 최정열, "SnBi 저온솔더의 플립칩 본딩을 이용한 스마트 의류용 칩 접속공정" 한국마이크로전자및패키징학회 19 (19): 71-76, 2012
5 C. Y. Lim, "Mechanical and Electrical Stability IndiumTin-Oxide Coated Polymer Substrates under Continuous Bending Stress Condition" 2 (2): 237-, 2012
6 T. C. Li, "Fatigue life study of ITO/PET specimens in cyclic bending tests" 26 (26): 250-, 2015
7 T. C. Li, "Fatigue Life Study of ITO/PET Specimens in Terms of Electrical Resistance and Stress/Strain Via Cyclic Bending Tests" 9 (9): 577-, 2013
8 S. H. Choa, "Experimental Study for Improving Mechanical Reliability of Flexible ITO Films" 3205 : 2011
9 J. K. Yang, "Effect of twisting fatigue on the electrical reliability of a metal interconnect on a flexible substrate" 2017 : 422-, 2017
10 K. Alzoubi, "Bending Fatigue Study of Sputtered ITO on Flexible Substrate" 7 (7): 593-, 2011