Reusing of electroless Ni-Cu-P waste solution was investigated in the plating time, plating rate and deposit.
It is difficult for initial solution with 55% waste solution additive at batch type to reuse the waste solution. Initial solution with 60% ...
Reusing of electroless Ni-Cu-P waste solution was investigated in the plating time, plating rate and deposit.
It is difficult for initial solution with 55% waste solution additive at batch type to reuse the waste solution. Initial solution with 60% waste solution additive at continuous type is a task of great difficulty to reuse of waste solution. Component change of nickel-copper for electroless deposition was increased by deposited inferiority and with decrease of plating time.