In this paper, we report the fabrication technology of Al-anodizing type electrostatic(ES) chuck which can be used in the semiconductor device fabrications. The use of the ES chuck in the semiconductor processing equipments is for the wafer holding. P...
In this paper, we report the fabrication technology of Al-anodizing type electrostatic(ES) chuck which can be used in the semiconductor device fabrications. The use of the ES chuck in the semiconductor processing equipments is for the wafer holding. Probable processing equipments are dry etchers, ashers, and sputters. A lot of plasma generations are reqired in their system, and the wafers could change their position during the processing. Fig. 1 shows an example of the use of ES chuck in the sputter system. The ES chuck technologies has been classified by three different types depending on the surface materials- polyimide, ceramic, and Al-anodizing ES chuck. Al-anodizing chuck is known to be the most effective technology for the protection from the plasma processing.