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    KCI등재 SCI SCIE SCOPUS

    Effects of CH<sub>4</sub> Gas and Substrate Temperature on Hydrogenated Amorphous Carbon (a-C:H) Films Fabricated Using DC Facing Target Sputtering

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    https://www.riss.kr/link?id=A104212720

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    Hydrogenated amorphous carbon (a-C:H) films were deposited on soda-lime glass substrates by using a DC facing target sputtering system. The effects of the CH<sub>4</sub> gas and the substrate temperature on the deposition rate and the properties of the film were investigated. We found that the deposition rate of the film grown under an Ar-CH<sub>4</sub> plasma was about three times larger than that of the film grown under an Ar plasma. The CH<sub>4</sub> gas played a role as an additional carbon precursor to increase the deposition rate, which could be seen as a CH<sup>*</sup> peak at 431 nm in the optical emission spectra of the Ar-CH<sub>4</sub> plasma. The <i>sp</i><sup>3</sup> fraction in the film increased gradually from 32 to 37% as the substrate temperature was increased from 100 ℃ to 400 ℃. The optical band-gap energy of the a-C:H films varied from 3.9 to 3.98 eV, and this variation was closely related to changes in the sp<sup>3</sup> fraction. Overall, these results indicate that the addition of CH<sub>4</sub> gas to a-C:H film deposition enhanced the deposition rate by changing the deposition mechanism from physical to reactive.
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    Hydrogenated amorphous carbon (a-C:H) films were deposited on soda-lime glass substrates by using a DC facing target sputtering system. The effects of the CH<sub>4</sub> gas and the substrate temperature on the deposition rate and the prop...

    Hydrogenated amorphous carbon (a-C:H) films were deposited on soda-lime glass substrates by using a DC facing target sputtering system. The effects of the CH<sub>4</sub> gas and the substrate temperature on the deposition rate and the properties of the film were investigated. We found that the deposition rate of the film grown under an Ar-CH<sub>4</sub> plasma was about three times larger than that of the film grown under an Ar plasma. The CH<sub>4</sub> gas played a role as an additional carbon precursor to increase the deposition rate, which could be seen as a CH<sup>*</sup> peak at 431 nm in the optical emission spectra of the Ar-CH<sub>4</sub> plasma. The <i>sp</i><sup>3</sup> fraction in the film increased gradually from 32 to 37% as the substrate temperature was increased from 100 ℃ to 400 ℃. The optical band-gap energy of the a-C:H films varied from 3.9 to 3.98 eV, and this variation was closely related to changes in the sp<sup>3</sup> fraction. Overall, these results indicate that the addition of CH<sub>4</sub> gas to a-C:H film deposition enhanced the deposition rate by changing the deposition mechanism from physical to reactive.

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    참고문헌 (Reference)

    1 J. Robertson, 37 : 129-, 2002

    2 C. Oppedisano, 75 : 3650-, 1999

    3 P. K. Chu, 96 : 253-, 2006

    4 H. T. Kim, 86 : 2148-, 2012

    5 Y. Miyajima, 105 : 073521-, 2009

    6 F. C. Marques, 30 : 527-, 2000

    7 H. P. Wang, 204 : 2246-, 2010

    8 J. Robertson, 50 : 185-, 1992

    9 B. Dishler, 48 : 105-, 1983

    10 J. Tauc, 15 : 627-, 1966

    1 J. Robertson, 37 : 129-, 2002

    2 C. Oppedisano, 75 : 3650-, 1999

    3 P. K. Chu, 96 : 253-, 2006

    4 H. T. Kim, 86 : 2148-, 2012

    5 Y. Miyajima, 105 : 073521-, 2009

    6 F. C. Marques, 30 : 527-, 2000

    7 H. P. Wang, 204 : 2246-, 2010

    8 J. Robertson, 50 : 185-, 1992

    9 B. Dishler, 48 : 105-, 1983

    10 J. Tauc, 15 : 627-, 1966

    11 J. E. Castle, 106 : 65-, 2000

    12 J. Schwan, 80 : 440-, 1996

    13 A. C. Ferrari, 61 : 14095-, 2000

    14 S. V. Avtaeva, 33 : 774-, 2007

    15 A. V. Eletskii, 39 : 1137-, 1996

    16 F. C. Marques, 83 : 3099-, 2003

    17 J. P. Sullivan, 26 : 1021-, 1997

    18 J. R. Shi, 198 : 437-, 2005

    19 J. R. Shi, 420 : 172-, 2002

    20 S. S. Nathan, 292 : 20-, 1997

    21 J. Mort, "Plasma Deposited Thin Films" CRC Press Inc. 1986

    22 Hong Tak Kim, "Measurements of Plasma Parameters in Low-Frequency (60 Hz) Hydrogen Discharge" 한국물리학회 42 (42): 916-919, 2003

    23 M. Ohring, "Materials Science of Thin Films" Academic Press 2002

    24 K. A. Jackson, "Kinetic Process: Crystal Growth, Diffusion, and Phase Transitions in Materials" Wiley-VCH 2004

    25 S. M. Rossnagel, "Handbook of Plasma Processing Technology: Fundamentals, Etching, Deposition, and Surface Interactions" Noyes Publications 1990

    26 김홍탁, "Effects of nitrogen flow rate on titanium nitride films deposition by DC facing target sputtering method" 한국화학공학회 29 (29): 676-679, 2012

    27 S. Sivaram, "Chemical Vapor Deposition: Thermal and Plasma Deposition of Electronic Materials" Van Nostrand Reinhold 1995

    28 NIST, "Atomic Spectra Database Lines Data"

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    2020-01-01 등재 등재학술지 유지 (해외등재 학술지 평가) KCI등재
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    기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
    2016 0.47 0.15 0.31
    KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
    0.26 0.2 0.26 0.03
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