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    PCB 열전도 해석 결과를 적용한 정지궤도 위성용 GNSS 수신기 전자부의 신뢰성 분석 = Reliability Analysis of GNSS Receiver Electronics for GEO Satellites Applying PCB Thermal Conduction Analysis Results

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    https://www.riss.kr/link?id=A109444622

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    다국어 초록 (Multilingual Abstract) kakao i 다국어 번역

    Purpose: The purpose of this study was to analyze the reliability of GNSS receiver electronics that provide the Position, Velocity, and Timing (PVT) information necessary to determine the orbit of geostationary satellites.
    Methods: The reliability analysis was performed by applying the Part Count Analysis (PCA) and Part Stress Analysis (PSA) methods appearing in MIL-HDBK 217F(N2).
    Results: The predicted reliability values over the satellite's expected operational lifetime of 15.3 years using the PCA and PSA methods were 87.9% and 92.0%, respectively, indicating that the results obtained through PSA were approximately four percentage points higher.
    Conclusion: This study established a prediction method for the reliability of the electronics in GNSS receivers for geostationary satellites, which may enable the development of customized products that meet the reliability requirements of the system.
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    Purpose: The purpose of this study was to analyze the reliability of GNSS receiver electronics that provide the Position, Velocity, and Timing (PVT) information necessary to determine the orbit of geostationary satellites. Methods: The reliability ana...

    Purpose: The purpose of this study was to analyze the reliability of GNSS receiver electronics that provide the Position, Velocity, and Timing (PVT) information necessary to determine the orbit of geostationary satellites.
    Methods: The reliability analysis was performed by applying the Part Count Analysis (PCA) and Part Stress Analysis (PSA) methods appearing in MIL-HDBK 217F(N2).
    Results: The predicted reliability values over the satellite's expected operational lifetime of 15.3 years using the PCA and PSA methods were 87.9% and 92.0%, respectively, indicating that the results obtained through PSA were approximately four percentage points higher.
    Conclusion: This study established a prediction method for the reliability of the electronics in GNSS receivers for geostationary satellites, which may enable the development of customized products that meet the reliability requirements of the system.

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    참고문헌 (Reference)

    1 "U.S. Air Force Avionics Integrity Program notes"

    2 A. Bar-Cohen, "Thermal frontiers in the design and packaging of microelectronic equipment" 1983

    3 Kraus, A. D., "Thermal Analysis and Control of Electronic Equipment" McGraw-Hill 1983

    4 L. T. Yeh, "Review of heat transfer technologies in electronic equipment" 117 (117): 333-339, 1995

    5 "RADC-TR-77-287 : A Redundancy Notebook"

    6 "MIL-HDBK-217F, Notice 2 : Reliability Prediction of Electronic Equipment"

    7 "ECSS-Q-ST-60C Rev.3 : Space Product Assurance-Electrical, Electronic and Electromechanical (EEE)Components, ESA-ESTEC Requirements and Standards Section" 2022

    8 "ECSS-Q-ST-30-11C Rev. 2. : Space Product Assurance-Derating–EEE Components"

    9 Younes Shabany, "Component size and effective thermal conductivity of printed circuit boards" 489-494, 2002

    10 Marcel Helda, "Comparison and evaluation of newest failure rate prediction models : FIDES and RIAC 217Plus" 49 : 967-971, 2009

    1 "U.S. Air Force Avionics Integrity Program notes"

    2 A. Bar-Cohen, "Thermal frontiers in the design and packaging of microelectronic equipment" 1983

    3 Kraus, A. D., "Thermal Analysis and Control of Electronic Equipment" McGraw-Hill 1983

    4 L. T. Yeh, "Review of heat transfer technologies in electronic equipment" 117 (117): 333-339, 1995

    5 "RADC-TR-77-287 : A Redundancy Notebook"

    6 "MIL-HDBK-217F, Notice 2 : Reliability Prediction of Electronic Equipment"

    7 "ECSS-Q-ST-60C Rev.3 : Space Product Assurance-Electrical, Electronic and Electromechanical (EEE)Components, ESA-ESTEC Requirements and Standards Section" 2022

    8 "ECSS-Q-ST-30-11C Rev. 2. : Space Product Assurance-Derating–EEE Components"

    9 Younes Shabany, "Component size and effective thermal conductivity of printed circuit boards" 489-494, 2002

    10 Marcel Helda, "Comparison and evaluation of newest failure rate prediction models : FIDES and RIAC 217Plus" 49 : 967-971, 2009

    11 John B. Bowles, "A survey of reliability-prediction procedures for microelectronic devices" 41 (41): 1992

    12 S. W. Yoo, "A study on the reliability prediction for space systems" 5 (5): 227-239, 2006

    13 I. T Jo, "A study on reliability prediction comparison of aerospace electronic equipments" 25 (25): 472-479, 2012

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