1 Theppakuttai S., "Localized Laser Transmission Bonding for Microsystem Fabrication and Packaging" 6 (6): 1-8, 2004
2 Schafer H., "Investigation of Ultrasonic Filp Chip Bonding on Flex Substartes"
3 Ready J. F., "Handbook of Laser Materials Processing" Laser Institute of America 138-, 2001
4 Tummala R. R., "Fundamentals of Microsystems Packaging" McGraw Hill 281-284, 2001
5 Kim J. W., "Evaluation of Thermo-mechanical Reliability of Flip Chip Solder Joints(I):I Pb-bearing Solder" 44 (44): 581-586, 2006
6 Li M. Y., "Development of a Flux-less Soldering Method by Ultrasonic Modulated Laser" 168 : 303-307, 2005
7 Kim S. W., "Bonding Properties of BGA Solder Ball with Laser Process" 45 : 2005
8 Teutsch T., "Advanced packaging" PennWell 2006
9 Ulrich R. K., "Advanced Electronic Packaging" Wiley-Interscience 417-418, 2006
10 Son H. K., "266nm DPSS Laser Micro Machining Technology" 47 (47): 19-21, 2007
1 Theppakuttai S., "Localized Laser Transmission Bonding for Microsystem Fabrication and Packaging" 6 (6): 1-8, 2004
2 Schafer H., "Investigation of Ultrasonic Filp Chip Bonding on Flex Substartes"
3 Ready J. F., "Handbook of Laser Materials Processing" Laser Institute of America 138-, 2001
4 Tummala R. R., "Fundamentals of Microsystems Packaging" McGraw Hill 281-284, 2001
5 Kim J. W., "Evaluation of Thermo-mechanical Reliability of Flip Chip Solder Joints(I):I Pb-bearing Solder" 44 (44): 581-586, 2006
6 Li M. Y., "Development of a Flux-less Soldering Method by Ultrasonic Modulated Laser" 168 : 303-307, 2005
7 Kim S. W., "Bonding Properties of BGA Solder Ball with Laser Process" 45 : 2005
8 Teutsch T., "Advanced packaging" PennWell 2006
9 Ulrich R. K., "Advanced Electronic Packaging" Wiley-Interscience 417-418, 2006
10 Son H. K., "266nm DPSS Laser Micro Machining Technology" 47 (47): 19-21, 2007