전자빔 필라멘트의 연구 및 개발 = Study and Development of Electron Beam Filament

다국어 초록 (Multilingual Abstract)

Thin film manufacturing process is placed on the main technology of semiconductor manufacturing process, high resolution technology of hard and laser disk , plate disc player manufacturing process of LCD/PDP. Furthermore, this process is used as general technology. in deposition and electric wave cover of mobile phone cover, reflecting plate of lamps, cosmetic vessel, optics surface coating of camera lens and coating film producing of several goods. In this research, the main purpose is developing in electric heat resistive using as basic material in semiconductor manufacturing process and many industrial processes. The developing process isas follows. Electron beam is emitted by heating of tungsten filament in high vacuum environment. Then electrons are accelerated in high voltage. The electrons are collided into opposite material . The opposite material is coating by producing heat. The first year of research is for mechanical property of filament wire per diameter and computer aided engineering for developing high efficiency electric heat resistive. The second year of research is focused on development of automatic inspection line for mass production. If electric heat resistive is developed through this project the product could be having a product power because of high efficiency , high cost effective and comparing to foreign goods.