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이 학술지의 논문 검색
From Telephony to Human Communication the Impact of Microelectronics
Ericson, B. The Society 1995 p.10-13
"Smart" Materials for a Changing Microelectronics Industry
Hodgson, J. C.;Saltzberg, M. A. The Society 1995 p.16-19
Kulojaervi, K.;Savolainen, P.;Kivilahti, J. The Society 1995 p.28-34
A Comparison of Non-Conductive and Anisotropic Conductive Adhesive for Surface Mount Application
Kristiansen, H.;Liu, J.;Bjoerneklett, A. The Society 1995 p.35-43
Flip Chip Interconnection to Organic Substrates: A Comparison Between Adhesive Bonding and Soldering
Jung, E.;Aschenbrenner, R.;Zakel, E.;Reichl, H. The Society 1995 p.44-53
Development of a Multichip-on-Flex and Single Chip-on-Flex Technology
Fillion, R.;Wojnarowski, R.;Saia, R.;Forman, G. The Society 1995 p.56-61
Non-Hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications
Hall, I. P. The Society 1995 p.62-73
Large AL/SIC Baseplate Packages for Digital and Microwave Applications
Lefeuvre, A.;Caplot, M.;Stranieri, C.;Massiot, P. The Society 1995 p.74-84