Multidisciplinary optimization of etch process chamber on the basis of MCDM

다국어 초록 (Multilingual Abstract)

A multidisciplinary optimization integrating flow and plasma performance was used to develop an etch process chamber with dualfrequencycapacitively coupled plasma. Pressure and ion density characteristics are significantly influenced by structures, such as electrodegap, number of confinement rings, electrode radius, and process conditions of flow rate. This study aims to minimize the objectivefunctions of pressure and ion density simultaneously. Based on flow and plasma simulation, an approximation model is created usingquartic response surface method (RSM). A genetic algorithm was utilized to explore Pareto front. The concept of entropy weight is combinedwith the weight defined in analytic hierarchy process to create a synthetic weight over the objectives. The non-dominated solutionsare ranked by the modified technique for order preference by similarity to ideal solution. The ranking list helps arrive at rational decisionsand provide a unique solution. The optimum structure of the chamber is obtained and the final solution is discussed. The proposed optimizationframework improves the distribution profile of pressure and ion density.

참고문헌 (Reference)

1 A. Beskok, "Report: a model for flows in channels, pipes, and ducts at micro and nano scales" 3 (3): 43-77, 1999

2 R. Stewart, "Plasma uniformity in high-density inductively coupled plasma tools" 4 (4): 36-, 1995

3 T. Ni, "Plasma confinement apparatus, and method for confining a plasma"

4 P. O’Dette, "Optimization of dry etch process conditions for HgCdTe detector arrays" 28 (28): 821-825, 1999

5 G. Tipton, "Optimization of an electron cyclotron resonance plasma etch process for n+ polysilicon: HBr process chemistry" 12 (12): 416-421, 1994

6 J. Lee, "Optimiza-tion of gas flow and etch depth uniformity for plasma etching of large area GaAs wafers" 46 (46): 685-688, 2002

7 R. Olson, "Optimiza-tion of a Low Damage, High Resolution Etch Process for SiN x in an ECR Reactor" 143 (143): 288-292, 1996

8 L. Yang, "Multiple-attribute decision-making approach for an energy-efficient facility layout design" 66 (66): 795-807, 2013

9 J. R. Martins, "Multidisciplinary design optimization: A survey of architectures" 51 (51): 2049-2075, 2013

10 R. Thirumalai, "Multi-criteria decision making in the selection of machining parameters for Inconel 718" 대한기계학회 27 (27): 1109-1116, 2013

11 X. Xu, "Modeling and Optimization of Pro-cess Parameters of a DF-CCP Etcher Chamber" 572 : 213-216, 2014

12 C. Jia, "Modeling Approach and Analysis of the Structural Parameters of an Inductively Coupled Plasma Etcher Based on a Regression Orthogonal Design" 14 (14): 1059-, 2012

13 D. P. Lymberopoulos, "Fluid simulations of glow discharges: Effect of metastable atoms in argon" 73 (73): 3668-3679, 1993

14 E. Kawamura, "Fast 2D hybrid fluid-analytical simulation of inductive/capacitive discharges" 20 (20): 035009-, 2011

15 P. Shufflebotham, "Experimental validation of a direct simulation by Monte Carlo molecular gas flow model" 13 (13): 1862-1866, 1995

16 Hong-Zhong Huang, "Evaluation and decision of products conceptual design schemes based on customer requirements" 대한기계학회 25 (25): 2413-2425, 2011

17 Z. H. Zou, "Entropy method for determination of weight of evaluating indicators in fuzzy synthetic evalua-tion for water quality assessment" 18 (18): 1020-1023, 2006

18 M. H. Khater, "Effects of gas dis-tribution on polysilicon etch rate uniformity for a low pressure, high density plasma" 16 (16): 490-495, 1998

19 D. A. Shumate, "Development of a TiW plasma etch process using a mixture experiment and response surface optimization" 9 (9): 335-343, 1996

20 V. Singh, "Designing low pressure systems with continuum models" 14 (14): 1252-1257, 1996

21 S. Chakraborty, "Design of a material handling equipment selection model using analytic hierarchy process" 28 (28): 1237-1245, 2006

22 D. L. Olson, "Comparison of weights in TOPSIS models" 40 (40): 721-727, 2004

23 C. Corr, "Comparison between fluid simulations and experi-ments in inductively coupled argon/chlorine plasmas" 41 (41): 185202-, 2008

24 L. Ren, "Comparative Analysis of a Novel M-TOPSIS Method and TOPSIS" 2007 : 2007

25 "CFD-ACE+ user’s manual"

26 Z. H. Bi, "A brief review of dual-frequency capacitively coupled discharges" 11 (11): S2-S8, 2011