자가부식 접착제의 미세인장접착강도에 대한 시효처리 효과 = AGING EFFECT ON THE MICROTENSILE BOND STRENGTH OF SELF-ETCHING ADHESIVES

국문 초록 (Abstract)

자가부식 상아질 접착제의 중합 후 시간 경과에 따른 접착강도의 변화를 관찰하고, 중합률의 영향을 평가하고자 하였다. 36개의 상하악 대구치를 Single Bond (SB. 3M ESPE, USA), Clearfil SE Bond (SE, Kuraray,Japan) , Xeno-Ⅲ (ⅩⅢ, Dentsply, Germany) , 및 Adper Prompt (AP 3M ESPE, USA)를 적용하는 4군으로 나누고, 이를 다시 미세인장접착강도 측정 시점에 따라 22℃의 증류수에 보관 후 48시간에 측정한 군과 7일 후 측정한 군, 및 접착된 시편을 5000회 열순환을 시행하고 측정한 군으로 나누었다. 모래시계 형태의 접착시편을 제작하여 만능시험기 (Model 4466 ; Instron Co., USA)로 1 mm/min의 하중속도 하에서 미세인장접착강도를 측정하였다. 접착제의 중합률은 Fourier 변환 적외선 분광법을 이용하여 중합 직후, 48시간, 1주일에 측정하였으며, 주사전자현미경을 이용하여 파절 단면을 관찰하였다. 미세인장접착강도와 중합률 모두 시간의 경과에 따라 유의한 증가를 보였으며, 시간 경과와 재료간에 교호작용이 있었다 (미세인장접착강도, 2-way ANOVA, p = 0.018; 중합률, Repeated Measures ANOVA, p ( 0.001). ⅩⅢ와 AP의 낮은 미세인장접착강도는 낮은 중합률 때문임을 확인할 수 있었다. 48시간 이후에 SE와 AP에서 접착강도가 증가 되는 것은 중합률과는 관련이 없고, 전자현미경에서 관찰되는 접착제층의 성숙에 따른 취성의 증가가 원인일 가능성이 제기된다.

다국어 초록 (Multilingual Abstract)

In this study, the changes in the degree of conversion (DC) and the microtensile bond strength (MTBS) of self-etching adhesives to dentin was investigated according to the time after curing. The MTBS of Single Bond (SB, 3M ESPE, USA), Clearfil SE Bond (SE, Kuraray, Japan), Xeno- Ⅲ (ⅩⅢ, Dentsply, Germany), and Adper Prompt (AP, 3M ESPE, USA) were measured at 48h, at l week and after thermocycling for 5,000 cycles between 5℃ and 55℃. The DC of the adhesives were measured immediately, at 48h and at 7 days after curing using a Fourier Transform Infra-red Spectrometer. The fractured surfaces were also evaluated with scanning electron microscope. The MTBS and DC were significantly increased with time and there was an interaction between the variables of time and material (MTBS, 2-way ANOVA, p = 0.018; DC, Repeated Measures ANOVA, p < 0.001). The low DC was suggested as a cause of the low MTBS of self-etching adhesives, XⅢ and AP, but the increase in the MTBS of SE and AP after 48h could not be related with the changes in the DC. The microscopic maturation of the adhesive layer might be considered as the cause of increasing bond strength.

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