With the expanded use of CMOS images sensors and the increased test quantity of the devices, this study performed the visual test (the naked eye based test) of CMOS image sensors in the type of automated test to find a faster and more accurate test me...
With the expanded use of CMOS images sensors and the increased test quantity of the devices, this study performed the visual test (the naked eye based test) of CMOS image sensors in the type of automated test to find a faster and more accurate test method, and described the test results.
In this thesis, automated visual test was conducted with defect chips. To investigate whether they are detected, DC test, part of the automated test, was applied to conduct OPEN/SHORT test. In this way, whether to detect "no signal" of the visual test was examined. Because of the difference in output pattern between visual test and automated test, the part that was unable to be detected on the basis of image was applied to ISP Function test, and thus the defect chips with "Abnormal Screen" in the visual test were detected. In addition, through CMOS image detection test, the defect chips with image distortion in the visual test were detected. For test reliability, 25,419 chips were used in automated test and visual test. According to the test result, there was the throughput difference of 9 %. The cause for the throughput difference was investigated. It was found that a worker's poor skill for detection caused 3 %, and random defects caused by internal and external impurities led to the 6 % difference.
In conclusion, by conducting the visual test in the type of automated test, it was possible to increase the test quantity by five folds, and to improve accuracy in the way of detecting the 3 % chips that could have been undetected by a worker's poor skill.