방전플라즈마 소결 공정을 이용한 CoSb3/Al/Ti/CuMo 접합 특성 = Joining Properties of CoSb3/Al/Ti/CuMo by Spark Plasma Sintering Process

다국어 초록 (Multilingual Abstract)

CoSb3-based skutterudite compounds are candidate materials for thermoelectric power generation in the mid-temperature range(600 - 900 K) because their thermoelectric properties can be enhanced by doping and filling. The joining property of thermoelectricmodule electrodes containing thermoelectric materials is of great importance because it can dominate the efficiency of thethermoelectric module. This study examined the properties of CoSb3/Al/Ti/CuMo joined by the spark plasma sintering technique.
Titanium thin foil was used to prevent the diffusion of copper into CoSb3 and Aluminum thin foil was used to improve the adhesionbetween CoSb3 and Ti. The insertion of an Aluminum interlayer between the Ti and CoSb3 was effective for joining CoSb3 to Ti byforming an intermediate layer at the Al-CoSb3 boundary without any micro cracks. Specifically, the adhesion strength of the Ti/Al/CoSb3 joining interface showed a remarkable improvement compared with our previous results, without deterioration of electricalproperty in the interface.

참고문헌 (Reference)

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