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      KCI등재 SCI SCIE SCOPUS

      Molecular Dynamics-Based Tension Simulation of Plastic Deformation of 2D Nanotwinned Copper Under Uniaxial Stress Conditions: Evolution of Dislocations and Secondary Twinning

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      https://www.riss.kr/link?id=A108215809

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      다국어 초록 (Multilingual Abstract)

      Adding nanotwins to a metal could be a way to effectively improve its strength without suppressing its tensile ductility, whichsuggests that their unique nanostructure may alter microstructure evolution and deformation mechanisms. In this work, weperform a molecular dynamics-based tension simulation of two-dimension (2D) polycrystalline copper (Cu) with embeddednanotwins under uniaxial stress conditions. The results of MD-simulation reveal that the spacing of the twin boundarieshad a significant effect on the mechanical properties of nanotwinned materials. Specifically, an irregular relationship isfound between the twin boundary spacing ( DT ) and the strength of the material. It exhibits that the peak stress reached amaximum at DT = 12.5 nm and decreased thereafter with increasing average DT . However, flow stress reaches a maximumat a critical value of DT = 7 nm. According to the analysis of microstructure evolution, the presence of nanotwins hinder themotion of partial dislocations and stacking faults, and the stress-concentrated region leads to the transition from coherenttwin boundaries to incoherency. The stress-concentrated region locates in the step of incoherent would release the intrinsicstacking faults responsible for the formation of hierarchical contraction nanotwins stacking faults which efficiently improvesthe strength of Cu. In addition, as the tension proceeds, some samples begin to display the secondary twinning. This workwill be helpful for further investigation the nucleation and evolution of 2D nanotwinned metals and for formulating effectivestrength criteria for 2D nanotwinned metals.
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      Adding nanotwins to a metal could be a way to effectively improve its strength without suppressing its tensile ductility, whichsuggests that their unique nanostructure may alter microstructure evolution and deformation mechanisms. In this work, weperf...

      Adding nanotwins to a metal could be a way to effectively improve its strength without suppressing its tensile ductility, whichsuggests that their unique nanostructure may alter microstructure evolution and deformation mechanisms. In this work, weperform a molecular dynamics-based tension simulation of two-dimension (2D) polycrystalline copper (Cu) with embeddednanotwins under uniaxial stress conditions. The results of MD-simulation reveal that the spacing of the twin boundarieshad a significant effect on the mechanical properties of nanotwinned materials. Specifically, an irregular relationship isfound between the twin boundary spacing ( DT ) and the strength of the material. It exhibits that the peak stress reached amaximum at DT = 12.5 nm and decreased thereafter with increasing average DT . However, flow stress reaches a maximumat a critical value of DT = 7 nm. According to the analysis of microstructure evolution, the presence of nanotwins hinder themotion of partial dislocations and stacking faults, and the stress-concentrated region leads to the transition from coherenttwin boundaries to incoherency. The stress-concentrated region locates in the step of incoherent would release the intrinsicstacking faults responsible for the formation of hierarchical contraction nanotwins stacking faults which efficiently improvesthe strength of Cu. In addition, as the tension proceeds, some samples begin to display the secondary twinning. This workwill be helpful for further investigation the nucleation and evolution of 2D nanotwinned metals and for formulating effectivestrength criteria for 2D nanotwinned metals.

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      참고문헌 (Reference)

      1 L. Lu, 304 : 422-, 2004

      2 F. Yuan, 113 : 203516-, 2013

      3 A. Cao, 102 : 083511-, 2007

      4 D. Xu, 85 : 2155-, 2008

      5 S. Li, 758 : 1-, 2019

      6 D. Jang, 7 : 594-, 2012

      7 Z. Cheng, 362 : eaau1925-, 2018

      8 X. Li, 41 : 298-, 2016

      9 O. Anderoglu, 93 : 083108-, 2008

      10 D. Bufford, 59 : 93-, 2011

      1 L. Lu, 304 : 422-, 2004

      2 F. Yuan, 113 : 203516-, 2013

      3 A. Cao, 102 : 083511-, 2007

      4 D. Xu, 85 : 2155-, 2008

      5 S. Li, 758 : 1-, 2019

      6 D. Jang, 7 : 594-, 2012

      7 Z. Cheng, 362 : eaau1925-, 2018

      8 X. Li, 41 : 298-, 2016

      9 O. Anderoglu, 93 : 083108-, 2008

      10 D. Bufford, 59 : 93-, 2011

      11 B. Cui, 55 : 4429-, 2007

      12 Y. Zhang, 60 : 211-, 2009

      13 X. Zhang, 88 : 173116-, 2006

      14 Q. Peng, 169 : 36-, 2019

      15 M. Bagheripoor, 143 : 103311-, 2020

      16 J. D. Honeycutt, 91 : 4950-, 1987

      17 A. Stukowski, 18 : 015012-, 2009

      18 O. Anderoglu, 26 : 875-, 2010

      19 L. Lu, 323 : 607-, 2009

      20 M. A. Meyers, 51 : 427-, 2006

      21 A. H. Chokshi, 23 : 1679-, 1989

      22 Z. Shan, 305 : 654-, 2004

      23 H. Van Swygenhoven, 60 : 22-, 1999

      24 V. Yamakov, 50 : 5005-, 2002

      25 X. Li, 464 : 8-, 2010

      26 A. Singh, 59 : 2437-, 2011

      27 Q. Pan, 551 : 214-, 2017

      28 Y. Mishin, 63 : 224106-, 2001

      29 S. Plimpton, 117 : 1-, 1995

      30 N. S. Martys, 59 : 3733-, 1999

      31 D. J. Evans, 83 : 4069-, 1985

      32 A. Stukowski, 20 : 085007-, 2012

      33 Jong-ha Park ; Soo-sang Park ; Xue-feng Han ; Kyung-woo Yi, "Numerical Analysis on Fluid Flow and Heat Transfer in the Smelting Furnace of Mitsubishi Process for Cu Refining" 대한금속·재료학회 22 (22): 118-128, 2016

      34 T. Varol ; A. Canakci, "Microstructure, Electrical Conductivity and Hardness of Multilayer Graphene/ Copper Nanocomposites Synthesized by Flake Powder Metallurgy" 대한금속·재료학회 21 (21): 704-712, 2015

      35 Jianwu Huang ; Youping Yi ; Shiquan Huang ; Fei Dong ; Wanfu Guo ; Dengliang Tong ; Hailin He, "Effects of Cryogenic Deformation on Second-Phase Al2Cu Particles and Mechanical Properties of 2219 Al–Cu Alloy Rings" 대한금속·재료학회 27 (27): 815-824, 2021

      36 Hyung Jin Kim ; Sun Ig Hong, "Effect of Ni Interlayer on the Interface Toughening and Thermal Stability of Cu/Al/Cu Clad Composites" 대한금속·재료학회 25 (25): 94-104, 2019

      37 Gi Hun Lee ; Jang Hyun Kim ; Hyeon Gyu Beom, "Cohesive Zone Modeling of Crack Propagation in FCC Single Crystals via Atomistic Simulations" 대한금속·재료학회 27 (27): 584-592, 2021

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      학술지 이력

      학술지 이력
      연월일 이력구분 이력상세 등재구분
      2023 평가예정 해외DB학술지평가 신청대상 (해외등재 학술지 평가)
      2020-01-01 평가 등재학술지 유지 (해외등재 학술지 평가) KCI등재
      2009-12-29 학회명변경 한글명 : 대한금속ㆍ재료학회 -> 대한금속·재료학회 KCI등재
      2008-01-01 평가 SCI 등재 (등재유지) KCI등재
      2005-01-01 평가 등재학술지 선정 (등재후보2차) KCI등재
      2004-01-01 평가 등재후보 1차 PASS (등재후보1차) KCI등재후보
      2002-01-01 평가 등재후보학술지 선정 (신규평가) KCI등재후보
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      학술지 인용정보

      학술지 인용정보
      기준연도 WOS-KCI 통합IF(2년) KCIF(2년) KCIF(3년)
      2016 2.05 0.91 1.31
      KCIF(4년) KCIF(5년) 중심성지수(3년) 즉시성지수
      1.03 0.86 0.678 0.22
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