CM/DM 노이즈 및 자기공진 주파수 영향 요인 분석을 통한 EMI 전도 특성 개선 방안 연구 = A study on ways to improve EMI conduction characteristics through analysis of factors influencing CM/DM noise and self-resonance frequency

다국어 초록 (Multilingual Abstract)

ABSTRACT
A Study on Ways to Improve EMI Conduction Characteristics through
Analysis of Factors Influencing CM/DM Noise and Self-Resonance
Frequency
by JAE-SEOK LEE
under the supervision of
Prof. RAE-YOUNG KIM, Ph. D.
Dept. of Electrical Engineering
The Graduate school of Hanyang University
This paper proposes by comparing and analyzing the factors affecting CM (Common Mode)
noise and DM (Differential Mode) noise, which are EMI (Electro-Magnetic Interference)
conducted noise, from a perspective other than filter design we suggest ways to improve
EMI conducted noise. Since the correlation between the influencing factors of noise has
been verified through actual measurement, it is possible to not only improve EMI conduction
noise with a filter, but also improve it in various directions. In addition, it is possible to
create a customized design that optimizes the EMI filter by matching the self-resonance
frequency to the noise frequency band by simply changing the inductor windings rather than
changing the inductance.

목차 (Table of Contents)

• 목차 i
• 그림 목록 ii
• 표 목록 iii
• 국문 요지 iv
• 제 1 장 서론 1
• 1.1 연구배경 및 필요성· 1
• 1.2 연구 내용 및 논문 구성 · 5
• 제 2 장 EMI 필터 7
• 2.1 인덕터와 커패시터의 자기공진 주파수 특성 · 7
• 2.2 CM/DM 필터 특성 10
• 제 3 장 CM 노이즈 영향 요인 분석 13
• 3.1 Y-cap 접지 13
• 3.2 PCB 프리프레그 16
• 제 4 장 DM 노이즈 영향 요인 분석 22
• 4.1 누설 인덕턴스 22
• 4.2 인덕터 몰딩 영향성 28
• 제 5 장 CM 인덕터 권선법을 통한 자기공진 주파수 설계 36
• 제 6 장 제안한 EMI 전도 노이즈 개선 방안 39
• 제 7 장 결론 · 41
• References · 42
• ABSTRACT · 44
• ii
• 그 림 목 록
• Fig. 1.1 Relationship between EMC, EMI and EMS. 2
• Fig. 1.2 Relationship between CM Noise and DM Noise in CE Noise. · 3
• Fig. 1.3 The Path of CM Conducted Noise (a) The path of CM Conducted Noise
• (b) The path of DM Conducted Noise. 5
• Fig. 2.1 Equivalent Circuit diagram (a) Equivalent Circuit diagram of Capacitor (b) Equivalent
• circuit diagram of Inductor (c) Impedance graph of Capacitor
• (d) Impedance graph of Capacitor. 9
• Fig. 2.2 EMI Filter Equivalent Circuit (a) Total EMI Filter Equivalent Circuit
• (b) CM Filter Equivalent Circuit (c) DM Filter Equivalent Circuit. 10
• Fig. 3.1 Depends on How well-designed Filter with Y-cap GND (a) Good Designed Filter with
• Y-cap GND (b) Measurement of Good Designed Filter with Y-cap GND (c) Bad Designed
• Filter with Y-cap GND (d) Measurement of Bad Designed Filter with Y-cap GND. 15
• Fig. 3.2
• Fig. 3.2 PCB 4 Layers Structure. 16
• Fig. 3.3 Simulation Result in Thickness of Prepreg (a) LISN ‘+’ LINE (b) LISN ‘-’ LINE · 18
• Fig. 3.4 Measurement Result in Thickness of Prepreg (a) LISN ‘+’LINE (Prepreg1.6T)
• (b) LISN ‘+’LINE (Prepreg 1.44T) (c) LISN ‘-’LINE (Prepreg 1.6T) (d) LISN
• ‘-’LINE (Prepreg 1.44T) 21
• Fig. 4.1 Equivalent Circuit when DM current flows in CM Inductor 23
• Fig. 4.2 Setup for measuring Solar Invertor in EMI Conduction Noise (a) Power supply
• (b) LISN & 1 : 1 Isolated Transformer (c) Solar Invertor
• (d) Solar Invertor Setup Diagram 25
• Fig. 4.3 The method for measuring leakage Inductance of CM Inductor · 25
• Fig. 4.4 The difference Leakage Inductance between CM Inductor #1 and #2
• (a) Leakage Inductance 9.7uH (CM Inductor #1)
• (b) Leakage Inductance 7.8uH (CM Inductor #2) · 27
• Fig. 4.5 DM Filter Simulation of Leakage Inductance 28
• Fig. 4.6 Diagram expressing the relationship between the capacitance distributed between
• the molding and the coil 29
• Fig. 4.7 A sample of Molding (a) Molding 33% (b) Molding 50% (c) Molding 100% 31
• Fig. 4.8 Measurement the Impact of Molding (a) No molding (b) Molding 33% (c) Molding 50%
• (d) Molding 100% (e) Measurement using SA · 34
• Fig. 5.1 From left to right Central Winding, General Winding, Centralized Winding 36
• Fig. 5.2 Measurement waveform of each Inductor – Red : Centralized Winding,
• Blue : General Winding, Green : Central Winding 37
• iii
• 표 목 록
• Table Ⅰ CM Inductance and Leakage Inductance Specification 26
• Table Ⅱ Self-Resonance Frequency and Capacitance with Molding and Without Molding 34
• Table Ⅲ CM Inductor Specification 37
• iv
• 국 문 요 지
• 본 논문에서는 EMI (Electro-Magnetic Interference) 전도 노이즈인 CM
• (Common Mode) 노이즈와 DM (Differential Mode) 노이즈에 영향을 주는 요인들
• 을 필터 설계 외적인 관점에서 비교하고 분석하여 EMI 전도 노이즈를 개선할
• 수 있는 방안을 제시한다. 실제 측정을 통해 노이즈의 영향성 요인에 대한 상
• 관관계를 검증하였으므로, EMI 전도 노이즈를 필터로 개선하는 것뿐만 아니라,
• 다각적인 방향에서 개선할 수 있게 한다. 또한 인덕턴스 변경이 아닌 인덕터
• 의 권선 변경만으로 자기공진 주파수를 노이즈 주파수 대역에 맞춰, EMI 필터
• 를 최적화하는 맞춤형 설계를 할 수 있다.